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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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TK110P10PL,RQ(S2)是东芝推出的N沟道增强型功率MOSFET,核心参数覆盖电压、电流、导通及开关特性,具体如下:
类别 参数名称 规格值 测试条件 基本特性 漏源击穿电压 Vdss=100V 栅源短路(Vgs=0V) 连续漏极电流 Id=40A 环境温度25℃ 脉冲漏极电流 Idp=60A 参考产品描述的脉冲条件 导通特性 导通电阻 RDS(on)=8.9mΩ Vgs=10V、Id=20A 栅源阈值电压 Vgs(th)=1.5~2.5V Id=250μA 开关特性 总栅极电荷 Qg=33nC Vgs=10V、Vds=50V 输入电容 Ciss=2.04nF Vds=25V、f=1MHz 反向传输电容 Crss=22pF 同输入电容测试条件 热学参数 最大耗散功率 Pd=75W 环境温度25℃ 封装 封装类型 TO-252-2(DPAK) 表面贴装、3引脚(实际)8.9mΩ的导通电阻处于同电压等级(100V)的低阻区间,可显著降低导通损耗。以连续工作电流40A为例,导通损耗仅为:
$$ P=I^2 \times R = 40^2 \times 8.9 \times 10^{-3} \approx 14.2W $$
远低于高阻MOSFET的损耗,减少散热片体积,降低系统成本。
连续40A、脉冲60A的电流能力覆盖多数中功率场景:
该器件采用表面贴装TO-252封装(描述中“-2”为笔误,实际为3引脚:G、D、S),具备以下优势:
东芝拥有数十年功率器件研发经验,产品一致性好、可靠性经市场验证,符合RoHS环保标准(无铅无卤),适配现代电子设备的环保要求。
TK110P10PL,RQ(S2)是一款高性价比100V N沟道MOSFET,以低导通电阻、快速开关速度和紧凑封装为核心竞争力,覆盖开关电源、电机驱动等中功率场景。东芝的品牌保障与可靠设计,使其成为此类应用的理想选择,可有效提升系统效率、降低成本并增强可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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