WMSIC Electronic Components

TLP715(TP,F) TLP715

ModelTLP715(TP,F)
PackageSOP-6-6.8mm
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP715(TP, F)
Type
TOSHIBA
Minimum package
1500

Technical parameters

Electronic Component
TOSHIBA
Electronic Component
TLP715(TP,F)
Electronic Component
1
Package
SOP-6-6.8mm
Electronic Component
Logic Output Optocoupler
Electronic Component
0.43g
Electronic Component
1
Channel Count
1
CMTI(kV/us)
10kV/us
Electronic Component
BM0035896856
Operating Temperature
40℃~+100℃
Operating Voltage
4.5V~20V
Type
DC
Output Current
25mA
(Vf)
1.6V
Current(If)
10mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP715(TP,F) 产品概述

1. 产品简介

TLP715(TP,F) 是东芝(TOSHIBA)公司设计的一款高性能逻辑输出光耦合器,封装形式为SOP-6,适用于多种电子电路中的信号隔离和转化。该产品的工作电压范围为4.5V至20V,能够在10kV/us的快速数据传输速率下运行,且具有5kV的绝缘电压,确保在高电压环境下的安全性与可靠性。

2. 主要特性

  • 高隔离电压:TLP715能够提供5kV的电气隔离,确保输入与输出电路之间的安全隔离,防止高压对低压部分的影响。
  • 快速开关速度:该光耦具备10kV/us的快速开关速度,适用于要求高数据传输速率的应用场合。
  • 宽工作电压范围:支持4.5V至20V的供电电压,具有良好的适应性,能够满足不同供电条件下的应用需求。
  • 小巧的封装设计:SOP-6封装使得TLP715在现代电子电路中占用更少的空间,适合高密度布局的电路设计。

3. 应用场景

TLP715(TP,F) 可广泛应用于以下几个主要领域:

  • 工业自动化:在工业控制设备中,用于各类传感器的信号传输和控制信号的隔离,有效提高系统的抗干扰能力。
  • 电源管理系统:适用于开关电源中的反馈回路,能够提供高效的电压反馈而不影响系统安全。
  • 通信设备:在数据通信模块中,能够实现信号的隔离与传输,保护通信设备免受电源波动带来的影响。
  • 消费电子:在家用电器等消费电子产品中,作为信号隔离组件,确保设备的安全性和稳定性。

4. 典型电路应用

TLP715的典型电路应用包括:

  • 通过光耦合器隔离的传感器接口电路。
  • 高压开关电源反馈回路。
  • 微控制器和外部设备之间的隔离传输。
  • 符合各种数据传输需求的登录和输出接口。

5. 性能参数

TLP715(TP,F)的主要电气特性如下:

  • 输入电流(IF):可在一定范围内调节,提供灵活的选择以适应不同需求。
  • 输出电流(IO):能够支持不同输出需求,并提供稳健的输出信号。
  • 传输延迟(tPHL, tPLH):具有较低的传输延迟,满足快速响应的应用需求。
  • 工作温度范围:通常工作温度在-40°C至+100°C之间,适应多种环境条件。

6. 结论

TLP715(TP,F)是一种兼具高可靠性和高效率的逻辑输出光耦,凭借其高隔离电压、快速开关速度和宽广的工作电压范围,成为各种电子设备中的理想选择。东芝凭借其强大的研发能力和市场经验,使得TLP715在行业中得到了广泛应用,是信号隔离与转换领域中不可或缺的关键电子元件。有了TLP715,设计工程师能够更加灵活和安全地应对未来各种电子产品的挑战。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.