WMSIC Electronic Components

TLP620(,F) TLP620

ModelTLP620(GB,F)
PackageDIP-4
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TOSHIBA TLP620(GB, F)
Type
TOSHIBA
Unit
Electronic Component
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP620(GB,F)
Electronic Component
1
Package
DIP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.384g
Electronic Component
1
Electronic Component
3us
Features
Integrated LED
Electronic Component
BM0107672955
Operating Temperature
55℃~+100℃
Load Voltage
55V
Type
AC,DC
Output Current
50mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP620(GB,F) 产品概述

一、产品简介

TLP620(GB,F) 是由东芝公司(Toshiba)推出的一款高性能光电隔离器,属于光电耦合器系列,采用归属于 DIP-4 封装形式,广泛应用于电气隔离和信号传输。该元器件设计为可以稳定有效地在交流(AC)和直流(DC)条件下工作,非常符合现代电子产品对隔离技术的基本需求。

二、主要特性

  1. 光电三极管输出: TLP620(GB,F) 的输出部分是光电三极管。,其特性使得该器件能够在一定负载下高效工作,输出电流可达到 50 mA,适用于各种小功率控制电路。

  2. 低导通电压: 本产品具有约 1.15V 的输出导通电压,能有效减少二次侧电路的功耗,提高整体效率。

  3. DIP-4 封装: DIP-4 封装设计使得该器件方便安装、贴装,适合于各种 PCB(印刷电路板)应用,为设计师提供更大的灵活性。

  4. 优越的抗干扰能力: TLP620(GB,F) 具备良好的抗电磁干扰能力,能够在相对恶劣的环境中保持稳定的输出性能。

  5. 温度范围: 设备工作温度范围广,通常适用于 -40℃ 到 +100℃ 的工况,这使得它在广泛的应用场合都能够表现出色。

三、应用场景

TLP620(GB,F) 的应用场景非常广泛,其中包括但不限于:

  1. 工业自动化: 在复杂的工业自动化系统中,TLP620 的隔离特性能有效保护控制电路,避免由于高电压或浪涌产生的不可预见的故障。

  2. 家用电器: 在一些小型家用电器中,如洗衣机、电冰箱等,能借助 TLP620 实现控制电路与主电路的有效隔离,提高设备的安全性和可靠性。

  3. 通信设备: 在数据传输过程中,TLP620 的隔离功能还能有效减少数据失真,保证信号的可靠传递。

  4. 医疗设备: 鉴于医疗设备对安全性和可靠性的极高要求,TLP620 作为光耦合器广泛应用于各类医疗仪器中,以确保患者和设备的安全。

四、性能参数

  • 输出电流: 50mA(最大值)
  • 导通电压: 1.15V(典型值)
  • 工作温度: -40℃ 至 +100℃
  • 封装类型: DIP-4
  • 输入电流: 根据光电二极管的激励条件而定

五、竞争优势

在众多光电隔离器中,TLP620(GB,F) 的竞争优势显而易见。首先,其优异的电流输出能力和较低的导通电压使其能够在多种负载条件下保持良好的性能表现。其次,通过东芝的先进制造工艺,TLP620 在稳定性和耐用性方面也有突出表现。此外,东芝作为知名品牌,其售后服务体系和技术支持备受客户信赖,进一步提升了用户体验。

六、总结

总之,TLP620(GB,F) 作为一款高性能的光电耦合器,以其卓越的特性和广泛的应用领域,成为电气隔离领域的一款重要元器件,其可靠性和高效性为现代电子设备的设计提供了有力支持。无论是在工业、家电、通信还是医疗领域,TLP620 都将发挥出重要的角色,满足设计师和工程师们对高标准、高品质电子元件的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.