WMSIC Electronic Components

TLP183(TPL,E(T TLP183

ModelTLP183(TPL,E(T
PackageSOP-4
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TLP183(TPL, E(T
Type
TOSHIBA
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TLP183(TPL,E(T
Electronic Component
1
Package
SOP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0229988431
Operating Temperature
55℃~+125℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW
(tr)
2us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TLP183(东芝)晶体管输出光耦 — 产品概述

一、产品简介

TLP183 是东芝(TOSHIBA)出品的一款晶体管输出型光电隔离器,输入为直流 LED,输出为光耦晶体管(Phototransistor)。该器件提供高达 3.75 kVrms 的输入输出隔离电压,适用于需要电气隔离和信号传输的工业与消费电子场合。封装为 SOP-4,便于表面贴装与电路板布局。

二、主要特性

  • LED 正向压降 (Vf):约 1.25 V(典型值)。
  • 最大 LED 正向电流 (If):50 mA(脉冲或短时驱动需留意热极限)。
  • 输出集电极电流:最大 50 mA;输出耐压(负载电压)可达 80 V。
  • 隔离耐压:3.75 kVrms(加强的安全隔离能力)。
  • 直流反向耐压 Vr:5 V(LED 反向保护参考)。
  • 集射极饱和电压 VCE(sat):≈300 mV(给定测试点 2.4 mA、8 mA 时测得)。
  • 电流传输比 CTR:最小 50%,最高可达 600%(随 If 与测试条件幅度变化较大)。
  • 上升时间 tr:约 2 μs,适合中速开关应用。
  • 工作温度:-55 ℃ 至 +125 ℃。
  • 总功耗 Pd:200 mW(器件与封装的热限制需关注)。

三、典型电气参数与使用建议

TLP183 的 CTR 随 LED 驱动电流与负载条件幅度变化显著——在低 If 时 CTR 接近规格下限(>=50%),在适当驱动下可达到数百百分比。设计时应按所需输出电流反推 LED 驱动电流,例如目标 Ic=10 mA、CTR=100% 时需 If≈10 mA。VCE(sat) 低(≈0.3 V)有利于降低导通损耗。上升时间 2 μs 表明器件适合控制信号、逻辑隔离与一般 PWM,但不适合高频高速数据链路。

四、应用场景

  • 微控制器与高压电路之间的信号隔离与接口驱动。
  • 开关电源的反馈环路隔离。
  • 电机驱动与电源控制中的状态检测。
  • 工业控制、医疗仪器与家电产品中的安全隔离应用。

五、封装与热管理

SOP-4 表面贴装封装方便自动化生产,但因 Pd 仅 200 mW,长期大电流 If 或高环境温度下需注意散热与退耦。布局时保证足够的 PCB 散热面与器件间距,同时满足沿面距离与爬电距离以保持隔离等级。

六、选型与注意事项

  • 若需长期大电流驱动,评估器件温升并考虑并联或改用更高功率器件。
  • CTR 范围宽,实际设计应根据最差条件(最低 CTR)来保证输出电流裕量。
  • 若用于高速信号,考虑光耦的响应时间和可能的等效电容引起的延迟。
  • 确认实际应用中的负载电压、耐压与隔离等级需求,合理选择 TLP183。

总体而言,TLP183 以其高隔离电压、较宽的 CTR 范围和紧凑 SOP-4 封装,适合多种需要安全隔离和中速信号传输的场合,是一种通用且可靠的光电隔离解决方案。

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