WMSIC Electronic Components

TC4069UBFT(EL,N) TC4069UBFT

ModelTC4069UBFT(EL,N)
PackageTSSOP-14
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TC4069UBFT(EL, N)
Type
TOSHIBA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TC4069UBFT(EL,N)
Electronic Component
1
Package
TSSOP-14
Electronic Component
Inverter
Electronic Component
4000B
Electronic Component
0.1g
Electronic Component
1
Electronic Component
1
Channel Count
6
Electronic Component
BM0263477912
Operating Temperature
40℃~+85℃
Operating Voltage
3V~18V
Current(IOH)
3.4mA
Current(IOL)
3.4mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC4069UBFT(EL,N) — 六路反相器产品概述

一、产品简介

TC4069UBFT(EL,N) 是东芝(TOSHIBA)生产的 4000B 系列 CMOS 六路反相器(Hex Inverter),封装为 TSSOP-14。器件工作电压范围宽广,适用于传统的低压与中高压系统(3V ~ 18V)。每个单元为单输入单输出的反相器,整片包含 6 个独立反相通道,适合通用逻辑反相、缓冲与信号整形等应用场景。

二、主要电气参数(典型/代表性数据)

  • 工作电压(VCC):3 V ~ 18 V
  • 静态电流(Iq,片级典型):约 1 μA(静态、无载条件)
  • 通道数:6(每通道 1 个输入、1 个输出)
  • 输出驱动能力:
    • 灌电流 IOL(下拉):3.4 mA(典型)
    • 拉电流 IOH(上拉):3.4 mA(典型)
  • 输入阈值范围:
    • 输入高电平 VIH:4 V ~ 12 V(随 VCC 与工况变化)
    • 输入低电平 VIL:1 V ~ 3 V(随 VCC 与工况变化)
  • 输出高电平(VOH,典型值示例):
    • VCC = 5 V → VOH ≈ 4.95 V
    • VCC = 10 V → VOH ≈ 9.95 V
    • VCC = 15 V → VOH ≈ 14.95 V
  • 传播延迟 tpd:约 50 ns @ VCC = 15 V, CL = 50 pF
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 系列:4000B(宽压 CMOS 逻辑)

三、封装与品牌信息

  • 品牌:TOSHIBA(东芝)
  • 封装:TSSOP-14(14 引脚薄型小外形封装)
  • 适合 SMT 贴片工艺,适用于空间和高度受限设计。

四、特性亮点

  • 宽工作电压范围(3 V ~ 18 V),便于在多种电源环境下直接使用,无需额外电平转换(在满足输入阈值约束下)。
  • 超低静态电流(约 1 μA),适合对静态功耗敏感的电池供电与低功耗系统。
  • 典型 VOH 接近 VCC,输出为推挽结构,在中低负载下可提供良好逻辑电平。
  • 属 4000B CMOS 系列,抗噪声能力好,器件结构使得功耗随频率显著上升(高频时需注意功耗管理)。

五、典型应用场景

  • 通用逻辑反相与缓冲:单片内多通道可用于多个信号线的逻辑反相。
  • 电平接口与电源跨接场合(在满足输入阈值条件下用于不同电压域的信号处理)。
  • 时序电路、脉冲整形、振荡器(与外部 RC 元件配合)。
  • 低功耗控制电路、便携设备与工业控制模块中作为逻辑单元。

六、设计与使用建议

  • 去耦电容:为保证瞬态响应与减少电源噪声,建议靠近 VCC 与 GND 引脚放置 0.01 μF ~ 0.1 μF 的陶瓷去耦电容。
  • 输出负载限制:器件典型 IOH/IOL 为 3.4 mA,若需驱动较大负载(例如多个输入或较低阻抗负载),应使用缓冲器或外部驱动器,避免输出电平下降或传播延迟增加。
  • 输入阈值注意:VIH 与 VIL 随 VCC 而变化。设计时确保输入信号幅值与器件在对应 VCC 下的阈值匹配,避免误触发或未定义状态。
  • 传播延迟与负载:传播延迟受 VCC、负载电容(CL)与输出电流影响,在高频或大电容负载下延迟会增加,应在时序设计中留有裕量。
  • ESD 与稳态保护:CMOS 器件对静电敏感,焊接、搬运与测试时注意静电防护。电路板设计中可在容易受到干扰的输入端加入适当阻容滤波或 TVS 保护元件。

七、封装与安装注意

  • TSSOP-14 为细间距引脚封装,锡膏印刷与回流曲线需按厂商推荐工艺进行,避免桥接与焊点缺陷。
  • 引脚排列、引脚号及机械尺寸请参考东芝原厂数据手册(用于 PCB footprint、焊盘设计与热管理)。

八、结论

TC4069UBFT(EL,N) 是一款通用、低功耗、宽电源电压范围的六路 CMOS 反相器,适合在多种电源条件下进行逻辑反相与缓冲应用。对于对静态功耗有严格限制且负载不大的系统,该器件提供了良好的性能与稳定性。在实际应用中应注意输出驱动能力与输入阈值匹配,并做好电源去耦与封装焊接工艺控制,以获得最佳工作可靠性。

如需更详细的电气特性曲线、引脚图与典型应用电路,请参阅东芝 TC4069UB 数据手册或向供应商索取原厂资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.