WMSIC Electronic Components

TBD62083APG(Z,HZW) TBD62083APG

ModelTBD62083APG(Z,HZW)
PackageDIP-18
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA TBD62083APG(Z, HZW)
Type
TOSHIBA
Minimum package
800 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
TBD62083APG(Z,HZW)
Electronic Component
1
Package
DIP-18
Electronic Component
Darlington Transistor Array
Electronic Component
2.15g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0231140383
Operating Temperature
40℃~+85℃
Electronic Component
Electronic Component
Electronic Component
800
Collector Current(Ic)
500mA
Voltage(VI)
30V
Collector-Emitter Breakdown Voltage(Vceo)
50V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TBD62083APG(Z,HZW) 产品概述

一、产品简介

TBD62083APG(Z,HZW) 是东芝(TOSHIBA)推出的八路 DMOS 晶体管阵列,封装为 DIP-18,适合插入式安装与模块化设计。每通道为功率 DMOS 器件,具有集射极击穿电压 Vceo = 50V、最大集电极电流 Ic = 500mA 的能力,允许在较高电压与中等电流工况下驱动负载。器件最大输入电压(VI)为 30V,额定工作温度范围为 -40℃ 到 +85℃,适用于工业级及民用电子设备的常见工作环境。

二、主要特性

  • 八路独立 DMOS 输出,便于集中驱动多个负载。
  • Vceo = 50V,适合 12V~24V 以上常见电源系统。
  • 单通道最大 Ic = 500mA,能够驱动小型继电器、直流电机、LED 阵列等负载。
  • 最大输入电压 VI = 30V,保证在较高输入电压下的安全工作余量。
  • 工作温度范围 -40℃~+85℃,适合较宽环境温度变化。
  • DIP-18 封装,便于手工焊接与快速替换。

三、典型应用场景

  • 工业控制:驱动继电器、接触器线圈及执行器。
  • 打印/复印设备:驱动步进电机或打印头控制电路。
  • 消费电子:LED 显示与背光驱动、蜂鸣器与小型马达控制。
  • 汽车电子(非高温区):车载辅助电路中对 12V 负载的集中驱动(需符合车辆使用条件)。

四、使用建议与注意事项

  • 热管理:尽管单通道 Ic 可达 500mA,长期或多通道同时高流工作时需注意 PCB 附加散热(加大铜箔、扩展散热面或安装散热片)。
  • 感性负载保护:若驱动继电器、马达等感性负载,若器件本身未包含续流二极管,应在每个负载两端并联外部续流二极管或 RC 抑制器,防止反向峰值损伤。
  • 电源与接地:保证稳定的电源与良好接地,输出回路与驱动回路的走线要短且粗,减少寄生电感与压降。
  • 输入驱动:确认输入驱动电平与器件允许的 VI 匹配,避免超过最大输入电压 30V。
  • 并联使用:若需超过单通道电流能力,应采用并联通道并注意电流均流和热分布,优先参考东芝数据手册获得并联指导。
  • 环境条件:在极端温度或潮湿环境下使用时,注意封装可靠性与防潮处理。

五、封装与引脚提示

DIP-18 封装适合原型测试与较小批量生产。由于不同版本(Z、HZW)在标识或包装上可能存在差别,设计时请以东芝官方数据手册的引脚定义为准;在批量设计中建议将器件放置于便于散热与检修的位置,并为每一路输出预留过流与短路保护设计余量。

六、结论

TBD62083APG(Z,HZW) 是一款面向多路集中驱动的 DMOS 晶体管阵列,凭借 50V 的耐压和 500mA 的单通道电流能力,适合驱动多种中等功率负载。在实际应用中,应重视热管理与感性负载的抑制措施,并严格参照东芝数据手册完成电气与热设计,以确保长期可靠性与系统稳定性。若需更详细的电气特性、引脚排列及典型应用电路,请查阅官方规格书或联系供应渠道获取认证资料。

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