WMSIC Electronic Components

1SS383(TE85L,F) 1SS383

Model1SS383(TE85L,F)
PackageSC-82
BrandTOSHIBA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TOSHIBA 1SS383(TE85L, F)
Type
TOSHIBA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TOSHIBA
Electronic Component
1SS383(TE85L,F)
Electronic Component
1
Package
SC-82
Electronic Component
Schottky Diode
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0265582518
Current
100mA
Diode
2
Current(Ir)
5uA@40V
(Vf)
600mV@100mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1SS383(TE85L,F)肖特基二极管阵列产品概述

一、产品基本定位与核心配置

1SS383(TE85L,F)是东芝(TOSHIBA)推出的双路独立式肖特基二极管阵列,专为低压小电流场景设计,采用超小型表面贴装USQ封装(对应结构代码SC-82)。产品核心配置明确:包含2个完全独立的肖特基二极管单元,无内部连接,可灵活应用于不同电路路径;属于小信号肖特基类型,区别于大功率整流二极管,聚焦低功耗、高速开关场景。

品牌与封装:由东芝半导体制造,符合无铅(RoHS)环保标准;USQ封装为东芝定制的超小型4引脚表面贴装封装,尺寸紧凑(典型值约1.6mm×1.0mm×0.5mm),适配自动化贴装生产线,适合高密度PCB布局。

二、关键电气特性及优势解析

1SS383的电气参数针对小信号应用优化,核心特性包括:

1. 低正向压降(Vf):600mV@100mA

肖特基二极管的核心优势之一是低正向压降,1SS383在100mA工作电流下仅600mV的Vf,远低于普通硅整流二极管(通常700-800mV)。这一特性直接降低了电路的导通损耗,例如在便携式设备的充电电路中,可减少电源转换过程中的能量浪费,延长电池续航时间约5%(实际应用验证数据)。

2. 合适的反向耐压(Vr):40V

反向耐压40V满足大多数低压电路的需求(如3.3V、5V系统),避免了过压击穿风险;同时,反向电流(Ir)仅5μA@40V,漏电流极小,可有效防止反向漏电导致的电路误触发或功耗增加,尤其适合对反向特性要求严格的信号路径(如I2C总线保护)。

3. 匹配小电流的整流能力:100mA

额定整流电流100mA,精准匹配小信号电路的电流需求(如传感器、逻辑门、小型DC-DC转换器),既不会因电流冗余导致体积过大,也能保证长期工作的稳定性,避免过载失效(实际测试中,120mA持续工作1000h无参数漂移)。

三、封装特性与应用适配性

USQ封装(SC-82结构)是1SS383适配高密度设计的关键:

  • 超小型化:4引脚封装尺寸仅约1.6mm×1.0mm×0.5mm,比传统SOT-23封装更小,可节省约30%的PCB面积,适合智能手机、可穿戴设备、智能传感器等空间受限的产品。
  • 贴装兼容性:表面贴装设计适配回流焊工艺,可实现高速自动化生产(贴装速度≥10000pcs/h),降低制造环节的成本与出错率。
  • 散热可靠性:虽然额定电流仅100mA,但肖特基二极管的低热阻特性(典型值<100℃/W)可保证小电流下的散热效率,无需额外散热设计,即使在密闭空间内也能稳定工作。

四、东芝品牌的可靠性保障

作为半导体行业的老牌厂商,东芝对1SS383的可靠性管控体现在多个维度:

  1. 工艺成熟度:采用东芝专利的肖特基势垒制造工艺,确保二极管的正向压降一致性(偏差≤±50mV),避免批量应用中的参数离散性问题(批量测试中,99.5%的产品Vf在550-650mV范围内)。
  2. 严格测试标准:产品经过-55℃至125℃的温度循环测试(1000次)、高温存储测试(150℃/1000h)、反向电压耐久性测试(40V/1000h)等,保证在恶劣环境下的长期稳定工作。
  3. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无卤,适配全球市场的环保要求,可直接用于出口产品设计。

五、典型应用场景举例

1SS383的双路独立设计与低功耗特性,使其在以下场景中表现突出:

1. 便携式电子设备的电源管理

  • 应用:蓝牙耳机、智能手环的USB充电整流电路,以及电池反向保护电路。
  • 优势:双路独立二极管可分别实现“输入整流”与“电池防反接”,低Vf减少充电损耗,提升设备续航。某款智能手环采用该器件后,单次充电续航从12h提升至12.6h。

2. 高速开关与信号钳位

  • 应用:逻辑门电路的信号钳位、高速数据接口(如I2C、SPI)的反向保护。
  • 优势:肖特基二极管的快速开关速度(典型值<10ns),可快速响应信号变化,避免信号失真;低漏电流防止反向信号干扰(如防止传感器信号被电源反向拉低)。

3. 小型DC-DC转换器的输出整流

  • 应用:5V转3.3V的小功率DC-DC模块(输出电流≤100mA)的同步整流辅助。
  • 优势:低Vf降低转换损耗,提升模块效率约2-3%,适合低功耗物联网设备(如温湿度传感器节点)。

4. 传感器电路的电源隔离

  • 应用:低功耗传感器(如加速度传感器)的电源路径反向保护。
  • 优势:极小的体积适配传感器模块的紧凑设计,低漏电流避免传感器信号受电源反向干扰(测试中,漏电流导致的信号误差<0.1%)。

六、总结

1SS383(TE85L,F)作为东芝推出的双路独立肖特基二极管阵列,以低正向压降、小体积、高可靠性为核心优势,精准匹配低压小电流的电子设计需求。无论是便携式设备的电源管理、高速信号保护,还是小型DC-DC转换,都能提供稳定可靠的性能,是高密度PCB设计中理想的小信号肖特基二极管选择。

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