WMSIC Electronic Components

TMI TMI3252S

ModelTMI3252S
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3252S
Type
TMI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3252S
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.023g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0228692752
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~18V
Switching Frequency
600kHz
Electronic Component
Electronic Component
Output Current
2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3252S DC-DC 降压型开关稳压器 产品概述

一、产品简介

TMI3252S 是拓尔微(TMI)推出的一款低功耗、高集成度的降压型 DC-DC 转换芯片,封装为 SOT-23-6,适合空间受限的嵌入式和便携设备。器件支持 4.5V 到 18V 的宽输入电压范围,单路可调输出,最大输出电流 2A,内部集成开关管,开关频率 600kHz,工作结温范围 -40℃ ~ +125℃。芯片采用同步整流结构以降低导通损耗并提升轻重载效率,静态电流仅 300μA,适合需要低待机功耗的系统。

二、主要特性

  • 输入电压:4.5V ~ 18V(宽输入范围,兼容典型 5V/12V 电源轨)
  • 输出电流:最大 2A,单路可调输出便于灵活设定输出电压
  • 开关频率:600kHz,有利于使用小体积电感与陶瓷电容,减小外部元件尺寸
  • 同步整流:内部同步 MOSFET,减少整流损耗,提高整体效率
  • 低静态电流:Iq ≈ 300μA,适合低功耗或待机场景
  • 工作温度:-40℃ ~ +125℃(TJ),适应工业级环境
  • 封装:SOT-23-6,体积小便于贴片组装

三、典型应用场景

  • 嵌入式控制板、单板计算模块的 5V/3.3V 电源生成
  • 通信、监控与物联网终端的主电源或局部供电
  • 工业自动化与仪器仪表的低中功率电源模块
  • 便携设备、车载电子(非安全关键电源)等需要小体积高集成度的场合

四、设计要点与选型建议

  • 外围元件:选择低 ESR 的陶瓷输入/输出电容以降低纹波;电感一般可选 2.2µH~4.7µH(根据输出电流与目标纹波调整),确保电感电流不超过饱和电流。
  • 输出设定:器件为可调输出,通过外部分压电阻网络设置反馈电压,请参考器件数据手册选择合适阻值范围以平衡功耗与噪声。
  • 布局要点:输入电容尽量靠近 VIN 与 GND 引脚,开关节点(SW)走线短且远离敏感模拟信号,地线分离并在地平面处良好连接,必要时使用热沉铜箔或过孔散热。
  • 保护与限流:虽然芯片内部集成开关管和保护功能,但在高应力或瞬态电流场景建议在输入端加熔断器/限流措施并在输出侧考虑合适的软启动与负载保护策略。

五、封装与热管理

SOT-23-6 封装小巧,适用于紧凑 PCB 布局。由于器件在高电流下会产生热量,散热依赖 PCB 铜箔面积与过孔,建议在电源区增加散热铜箔并靠近地平面进行热传导。高环境温度或连续大电流输出时需评估结温并做降额设计。

六、常见注意事项

  • 在输入电压接近上下限和高温工况下需校核功率损耗与结温。
  • 高频开关会产生辐射和地回流噪声,布局和封装滤波要做好 EMI 控制。
  • 若用于要求更高输出稳定性或精度的应用,应参考典型应用电路并调试反馈网络与补偿元件。

TMI3252S 以其高集成度、宽输入范围与低静态电流特性,适合多数中低功率降压场景。设计时以数据手册为准,按典型应用电路布局与选型可快速构建稳定可靠的电源模块。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.