Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TMI TMI8118
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI8118
- Type
- TMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI8118
- Electronic Component
- 1
- Package
- SOT-23-6
- Electronic Component
- Brushed DC Motor Driver IC
- Electronic Component
- 0.047g
- Electronic Component
- 1
- Integrated FET
- Electronic Component
- H
- 1
- Features
- Electronic Component
- Electronic Component
- BM0226612927
- Resistor
- 550mΩ
- Current
- 2A
- Operating Temperature
- 30℃~+85℃
- Operating Voltage
- 1.6V~7.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI8118 产品概述
一、概述
TMI8118 是拓尔微推出的一款小型单通道 H 桥驱动芯片，内部集成 MOSFET，面向轻载直流电机及摆动/振动马达驱动应用。器件工作电压范围宽（1.6V~7.2V），静态电流极低（Iq = 100 nA），适合电池供电、低功耗场景；峰值输出能力可达 2A，封装为常见的 SOT-23-6，利于空间受限的消费类电子产品设计。
二、主要参数（关键规格）
- 集成 FET：是（H 桥结构，单通道）
- H 桥数量：1
- 峰值电流：2 A
- 工作电压：1.6 V ~ 7.2 V
- 导通电阻（RDS(on)）：550 mΩ（典型/最大视资料）
- 静态电流（Iq）：100 nA（极低待机功耗）
- 工作温度：-30 ℃ ~ +85 ℃
- 品牌：TMI（拓尔微）
- 封装：SOT-23-6
三、功能与优势
- 低电压驱动：支持低至 1.6V 的供电，适配单节锂电或低压系统。
- 低待机功耗：100 nA 的静态电流有助于延长电池寿命，适合长期待机的便携设备。
- 集成度高：内部集成 MOSFET，减小外部器件数量与 PCB 面积，简化布局。
- 封装小巧：SOT-23-6 便于手机配件、可穿戴、玩具等尺寸受限的应用。
四、典型应用场景
- 小型直流振动马达、微型齿轮电机驱动（玩具、手机振动、摄像头云台）
- 便携设备的方向控制与反转驱动（风扇、泵、微型致动器）
- 低功耗控制场合的单通道 H 桥需求
五、设计注意事项
- 电流与功耗：峰值 2A 仅限短脉冲，连续工作时需参考散热和芯片最大结温规格；550 mΩ 的导通电阻在较大电流下会产生较多热损耗，需评估功耗 P = I^2·R。
- 保护与滤波：尽管为集成 FET 结构，仍建议在驱动输出侧配合适的回授/抑制措施（TVS、RC 吸收、电感限流或外部续流二极管）以应对感性负载反向尖峰。
- 去耦与布局：输入电源近端放置足够的高频旁路电容（如 1 μF〜10 μF），走线尽量短且粗，保持散热通道，SOT-23-6 的热管理依赖 PCB 铜厚与散热铺铜。
- 电源与控制逻辑：确保控制引脚电平与芯片允许电压范围匹配，必要时使用电平移位或上拉/下拉电阻。
六、选型建议
若目标为超低功耗与占板面积小，同时驱动小型电机或振动器，TMI8118 是较合适的选择。但若负载电流长期接近或超过数百毫安且需更低功耗损耗，应考虑 RDS(on) 更低或具有更强散热能力的驱动器/分立 MOSFET 方案。最终选型请结合目标应用的最大连续电流、效率与热设计一并评估，并参考完整数据手册以确认极限参数与保护特性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
