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TMI TMI6263BH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI6263BH
- Type
- TMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI6263BH
- Electronic Component
- 1
- Package
- SOT-23-5
- Type
- Switch
- Electronic Component
- Power Electronic Switch
- Electronic Component
- 0.037g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Voltage; Current; Output
- Electronic Component
- BM0226163425
- Resistor
- 60mΩ
- Operating Temperature
- 40℃~+130℃
- Operating Voltage
- 2.5V~5.5V
- Current
- 2.4A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI6263BH 产品概述
一 特性摘要
TMI6263BH 是拓尔微（TMI）推出的一款单通道高侧开关，适用于 2.5V–5.5V 电源轨的负载断开与保护。器件支持最大连续输出电流 2.4A，典型导通电阻 RDS(on) ≈ 60mΩ，内置过热保护（OTP），工作温度范围 -40℃ 至 +130℃，封装为 SOT-23-5。输入控制逻辑为高电平有效，便于与 MCU 或电源管理逻辑直接接口。
二 典型电气性能
- 工作电压：2.5V ~ 5.5V，兼容 3.3V 与 5V 系统（如 USB 5V 场景）。
- 最大连续电流：2.4A（实际可用电流受封装散热和工况限制）。
- 导通电阻：60mΩ，满载时器件功耗可用 P = I^2·R ≈ (2.4A)^2·0.06Ω ≈ 0.346W，需关注热量管理。
- 控制：EN/输入引脚为高电平有效，直接由逻辑信号使能或关断。
三 输入控制与典型接法
TMI6263BH 提供简洁的使能控制：EN/CTRL 引脚高电平时导通，低电平时断开。建议使能信号电平参考器件 VCC，避免错误触发。实际电路中常在 VIN 与 VOUT 处各并联陶瓷电容（典型 1µF–10µF）以稳定瞬态响应并抑制振铃。
四 保护与可靠性
器件内置过热保护（OTP），当结温超过阈值时自动关断以保护芯片及外部负载，温度恢复至安全范围后自动恢复工作。工作温度覆盖工业级 -40℃~+130℃，适合严苛环境下长期可靠运行。注意长期满载时应考虑热关断与热耗散的影响，必要时进行热保护或限流设计。
五 典型应用场景
- 电池供电设备的负载开关与电源管理。
- USB/外设电源选择与保护（5V 电源开关）。
- 便携终端、物联网节点、传感器供电控制与上电浪涌限制。
- 需要低 RDS(on) 与紧凑封装的高侧保护与分配场合。
六 PCB 布局与散热建议
SOT-23-5 封装体积小，散热能力有限。推荐要点：
- VIN、VOUT 引脚处采用较宽铜箔并扩展到大面积散热铜皮。
- 在器件下方或附近留出热铜区域并做多层板过孔导热到内层或底层。
- VIN 处靠近封装放置低 ESR 陶瓷电容（例如 4.7µF–10µF），VOUT 处也建议放置输出旁路电容。
- 布线尽量短而粗，减少寄生电阻与电感，提升热均衡能力。
七 封装与选型参考
TMI6263BH 提供 SOT-23-5 小体积封装，便于空间受限设计。选型时除关注电流与电压规格外，应结合实际 PCB 散热条件和环境温度对最大持续电流进行保守评估。若需要更高电流或更强散热能力，可考虑更大封装或外部 MOSFET 方案。
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