WMSIC Electronic Components

TMI TMI3359

ModelTMI3359
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3359
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3359
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.045g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226613085
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~30V
Switching Frequency
1.5MHz
Electronic Component
Electronic Component
Output Current
1.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3359 可调降压型同步整流 DC-DC 电源芯片(SOT-23-6)产品概述

一、产品简介

TMI3359 是拓尔微(TMI)推出的一款单通道可调输出降压型开关稳压器,封装为 SOT-23-6。芯片集成同步整流开关管,支持 4.5V 至 30V 宽输入电压,最大输出电流 1.2A,内部开关频率为 1.5MHz,静态电流仅 350µA,工作结温范围 -40℃ 至 +125℃(TJ)。该器件适用于要求体积小、效率高、待机电流低的电源转换场合。

二、主要特性

  • 可调输出:通过外部分压电阻设定输出电压,灵活适配多种点负载电压需求。
  • 同步整流:内置同步 MOSFET,降低导通损耗,提高中高负载效率,无需外接肖特基二极管。
  • 高频工作:1.5MHz 开关频率,允许使用小尺寸电感与陶瓷电容,利于小型化布局。
  • 低静态电流:IQ≈350µA,适合电池供电及低功耗待机场景。
  • 宽输入与高温稳定:4.5V–30V 输入范围,适配工业与车载周边(需评估车规要求);TJ 工作至 +125℃。

三、典型应用

  • 工业控制与自动化模块的点位电源
  • 车载辅助电源(需按车规与瞬态保护设计)
  • 通信与物联网终端的局部降压(PMIC)
  • 消费类便携设备与小型嵌入式系统电源

四、设计要点与建议

  • 外围器件:
    • 电感:建议选择 0.47µH–2.2µH 范围,电流额定值 ≥ 1.5×输出电流以保证裕量;实际取值依输出电压、纹波与效率权衡。
    • 输入电容:使用低 ESR 陶瓷电容(例如 10µF~47µF),靠近 VIN 引脚布置以抑制输入电流尖峰。
    • 输出电容:低 ESR MLCC,容量常见 10µF~47µF,必要时并联少量钽电容以改善负载瞬变。
    • 反馈网络:按数据手册给定的参考电压设计分压比,实现期望输出电压与稳定环路相位裕度。
  • 布局与走线:
    • VIN、GND、开关节点(SW)与输入/输出电容走线最短并成闭环,减小寄生电感和辐射。
    • 将输入电容靠近 VIN 和 GND 引脚放置,开关节点远离敏感模拟线。
    • SOT-23-6 封装热散能力有限,若功耗较大建议增加铜面积做散热并优化底层铜皮。
  • 热与可靠性:
    • 在高输入差与高输出电流工况下,芯片功耗与结温显著上升,应进行热仿真并留裕量。
    • 在车载或工业环境,需配合瞬态抑制与滤波,防止输入浪涌损伤器件。

五、优势总结

TMI3359 在小封装下提供同步整流、高频率与低静态电流的组合,适合对体积和能效有较高要求的点位降压场景。设计中合理选择外部电感与电容并优化 PCB 布局,可获得良好的稳态效率与动态响应。

如需进一步电气参数(参考电压、引脚功能、典型效率曲线与 PCB 参考设计),建议参考 TMI 官方数据手册与典型应用电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.