WMSIC Electronic Components

TMI TMI33431E

ModelTMI33431E
PackageESOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI33431E
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI33431E
Electronic Component
1
Package
ESOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.183g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0228062490
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~30V
Switching Frequency
570kHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI33431E 产品概述

一、产品简介

TMI33431E 是拓尔微(TMI)推出的一款高集成度降压(Buck)开关稳压器,面向需要高效率、小体积与中等功率输出的电源设计场景。芯片内部集成高侧与低侧功率开关(同步整流),采用降压拓扑、单输出通道、ESOP-8 封装,适合车载、工业与消费类设备等宽温应用(工作结温 -40℃ 至 +125℃)。

二、主要参数与功能

  • 输出类型:可调输出,外接反馈分压即可设定目标电压;
  • 输入电压范围:4.5V ~ 30V,覆盖常见 12V/24V 总线及电池供电场景;
  • 输出电流:连续最大 3A,适合中等负载需求;
  • 开关频率:典型 570kHz,权衡了转换效率与外部元件体积;
  • 同步整流:集成同步整流 FET,降低整流损耗,提高效率;
  • 开关管:内部集成功率开关,无需外置功率器件;
  • 静态电流(Iq):典型 450µA,适合待机与中低负载能耗敏感应用;
  • 工作温度:-40℃ ~ +125℃(TJ),满足严苛环境要求;
  • 封装:ESOP-8,利于散热与 PCB 布局;
  • 拓扑与功能类型:降压型、单路输出、可调电压。

此外,器件通常集成常用保护与控制功能以保障系统可靠性:短路/过流限制、热关断(OTP)、欠压锁定(UVLO)以及软启动等(参考具体器件手册以确认完整功能列表与门限)。

三、典型应用场景

  • 汽车电子与车载辅助电源(12V/24V 总线降压);
  • 工业控制模块与传感器供电;
  • 通信设备、嵌入式主板与点位控制器的主/备用稳压;
  • 便携与固定电源管理,需兼顾效率与工作温度范围的场合。

四、设计与布局建议

  • 输入旁路:在靠近 VIN 引脚处并联放置 0.1µF 陶瓷和 10µF~47µF 的低 ESR 电解或陶瓷电容,以抑制开关尖峰与稳定输入总线;
  • 输出滤波:采用多只低 ESR MLCC(如 22µF ~ 100µF 总和,视输出纹波与负载动态而定),并注意并联布置以降低有效 ESR 与 ESL;
  • 电感选择:根据输出电流与允许纹波电流选择合适电感值与饱和电流(选择低 DCR、饱和电流高于峰值电流的器件);开关频率 570kHz 有利于使用较小体积电感;
  • 布局要点:输入电容、功率开关与电感形成的高频回路应最短最宽,开关节点(SW)走线尽量短,地线分为功率地与信号地并在器件附近汇流,ESOP-8 的底部散热焊盘务必焊接良好以提升热性能;
  • 热管理:在高负载与高环境温度下,需要借助铜箔扩散与散热板提高器件散热能力,避免长期接近 TJ 极限。

五、封装与可靠性

ESOP-8 封装在体积与散热之间取得平衡,适合表面贴装制造。器件工作结温范围广、静态电流低,适合长期工作与低功耗体系。设计时应关注过流、短路与过温保护机制,并在系统层面加入必要熔断或电流监控以提高可靠性。

六、选型与工程建议

  • 若系统需在更低输入电压下启动或更高输出电流,应核对器件手册确认 UVLO、导通电阻与电流限制参数;
  • 对效率与尺寸有更高要求时,可通过评估外置电感/电容特性和布局优化获得最优方案;
  • 项目进入样机验证阶段时,按数据手册的典型应用电路搭建并测量效率、纹波、热升等关键指标,必要时调整电感与滤波电容以满足系统需求。

如需进一步的电气参数曲线、典型应用电路图或布局参考 Gerber 设计建议,可提供具体需求与工作点(输入/输出电压、负载电流),以便给出更精确的器件选择与设计优化建议。

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