WMSIC Electronic Components

TMI TMI3282

ModelTMI3282
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3282
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3282
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.049g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258496678
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
3.5V~18V
Switching Frequency
1MHz
Electronic Component
Electronic Component
Output Current
2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3282 产品概述

一、产品简介

TMI3282 是拓尔微(TMI)推出的一款高集成度降压(Buck)稳压器,采用 SOT-23-6 小型封装,适用于空间受限的便携和工业应用。器件为降压型、内部开关管并支持同步整流,具有可调输出和高开关频率(1MHz),在宽输入电压范围下可稳定提供最高 2A 输出电流,适配多种电源管理场景。

二、主要特性

  • 功能类型:降压型(Buck)
  • 输入电压:3.5V ~ 18V
  • 最大输出电流:2A
  • 开关频率:1MHz(固定)
  • 同步整流:集成(提高效率、无需外接整流二极管)
  • 输出类型:可调(通过外部分压电阻设定)
  • 开关管:内置高侧/低侧开关晶体管
  • 工作温度(TA):-40℃ ~ +85℃
  • 封装:SOT-23-6(小尺寸,适合移动设备)

三、电气规格与集成特性

TMI3282 在 1MHz 高频工作下可以显著减小外部电感与电容体积,便于实现小型化电源解决方案。器件通常集成启动/关闭(EN)、反馈(FB)、开关(SW)、输入(VIN)、地(GND)和升压(BST)等功能引脚。为提升稳定性与可靠性,芯片内置稳态控制环路及常见保护功能(例如欠压锁定、过流和过热保护),便于在复杂工况下安全运行。

四、典型应用电路与元件选型

典型连接:VIN → 输入陶瓷电容(CIN)→ 芯片 VIN;芯片 SW 输出连接外部电感 L → VOUT;VOUT 旁并联输出电容(COUT);VOUT 通过分压电阻送回 FB 引脚设定输出电压;EN/使能引脚可连接至 VIN 或 MCU 控制。

  • 电感:推荐选择低 DCR、饱和电流大于 2A 的功率电感,常见值范围 1µH ~ 10µH,依据输入/输出电压及允许纹波选择。
  • 输入电容:推荐 4.7µF ~ 22µF 陶瓷(X5R/X7R),靠近 VIN 与 GND 布局。
  • 输出电容:推荐 22µF ~ 100µF 陶瓷,低 ESR 有助于稳定与降低输出纹波。
  • 升压电容(BST):一般为 0.01µF ~ 0.1µF 陶瓷,置于 BST 与 SW 之间。
  • 反馈电阻:根据目标输出电压按标准分压网络计算。

注意:由于采用同步整流,通常无需外接肖特基整流;但在特殊条件下可根据实际热与效率需求做补充设计。

五、PCB 布局与散热建议

  • 将 CIN 紧靠芯片 VIN 与 GND 引脚放置,缩短回流环路;COUT 与电感也应靠近 SW 与 VOUT 节点。
  • 将高电流走线尽可能加宽,并在 PCB 底层或内层使用大面积铜箔作为散热路径。
  • GND 采用完整地平面,避免噪声耦合到敏感信号;将反馈网络远离噪声源并通过短导线连接 FB。
  • 在高功率工况下需考虑器件热降额,保证工作环境温度和 PCB 散热能满足长期稳定工作。

六、典型应用场景与注意事项

适用于便携设备、通信模块、工业控制电源、车载辅助电源(需按车规要求验证)及各类需要从中高压输入降压到稳压电源的场合。设计时注意输入电压与负载瞬态条件、选择合适的电感/电容并验证热性能和效率曲线;在关键应用中,请参照最新版器件数据手册进行详细电气与可靠性评估。

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