WMSIC Electronic Components

TMI TMI3253T

ModelTMI3253T
PackageSOT-23-6
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3253T
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3253T
Electronic Component
1
Package
SOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.022g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0226613091
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
4.5V~18V
Switching Frequency
600kHz
Electronic Component
Electronic Component
Output Current
3A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3253T 产品概述

一、主要特性

TMI3253T 是一款降压型(Buck)同步整流开关稳压器,适用于点对点降压和电池供电系统。其关键参数如下:

  • 输入电压范围:4.5V ~ 18V
  • 输出电流:最高 3A(持续)
  • 开关频率:600kHz(固定)
  • 同步整流:内置同步MOS,提升转换效率
  • 静态电流(Iq):约 300µA,利于低功耗设计
  • 工作结温:-40℃ ~ +125℃(TJ)
  • 输出通道:单路,可调输出电压
  • 包装:SOT-23-6,内部集成高侧/低侧开关

TMI3253T 以内部开关管和同步整流降低外部元件数量,适合体积受限且需高效率的降压应用。

二、典型应用场景

  • 电池供电设备(便携仪器、便携式终端)
  • 单/多路点对点电源,MCU、传感器供电
  • 工业控制小功率负载点
  • USB 外围设备、通信模块和车载电子(在额定温度范围内)

三、封装与热管理

SOT-23-6 小封装便于高密度布局,但热阻较大:

  • PCB 布局应尽量利用宽铜箔和多层铜铺铜来散热。
  • 在底层或邻近区域增加散热铜面积并使用过孔(thermal vias)将热量导向内部或底层铜。
  • 选用额定温度裕度的外设(电感、电容)以保证长期可靠性。

四、外部元件选型与计算(要点)

  • 电感:根据占空比与电流纹波选择。建议纹波电流 ΔI 取 20%~40% Io(例如取 30%:ΔI = 0.3×3A = 0.9A)。计算公式: L = (Vin - Vout) × D / (ΔI × Fs),其中 D≈Vout/Vin,Fs=600kHz。
    例:若 Vin=12V, Vout=5V,则 D≈0.417,L ≈ (12-5)×0.417/(0.9×600k) ≈ 5.4µH。
    电感额定电流应大于峰值电流(Io + ΔI/2),并关注饱和电流与DC损耗。
  • 输入电容:采用低ESR MLCC(X5R/X7R),常见 10µF~47µF 并联布置,靠近 VIN 引脚放置降纹波和保持稳定性。
  • 输出电容:建议多路并联 MLCC 与钽电容,典型 22µF~100µF,取决于输出纹波与瞬态要求。
  • 反馈网络:输出可调,通过外部分压实现所需输出电压;注意分压阻值不宜过大以防噪声耦合,也不宜过小以防增加静态耗电。

五、PCB 布线要点

  • VIN、GND、SW、FB 等关键节点走线短且粗,减小寄生电感与环路面积。
  • 将输入电容紧贴 VIN 与 GND 引脚放置,输出电容紧贴开关节点与负载侧。
  • 将热流路径(开关电流回路)集中在同一层,避免穿过敏感模拟或高阻抗信号区。
  • 布局时注意将敏感反馈节点远离开关噪声源,必要时添加小阻抗或RC滤波进行稳定。

六、设计注意事项与调试建议

  • 在样机阶段测量开关节点波形与输出纹波,确认没有振荡或异常发热。
  • 根据负载动态特性调整输出滤波以满足瞬态响应。
  • 评估在最大输入电压与最大负载下的温升,并考虑适当的散热设计或减小封装温升。
  • 因为工作频率为固定 600kHz,选用电感与电容时应关注频率特性以避免额外损耗或共振。

TMI3253T 以其宽输入、3A 输出与低静态电流特点,适合对体积、效率与电池续航有要求的中小功率降压场合。设计时重点放在外部电感、电容的合理选型与 PCB 热/噪声布局上,可获得稳定可靠的降压性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.