WMSIC Electronic Components

TMI TMI3101C

ModelTMI3101C
PackageSOT-23-5
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI3101C
Type
TMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI3101C
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.051g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258345759
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
2.5MHz
Electronic Component
Electronic Component
Output Voltage
600mV~5.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI3101C 产品概述

TMI3101C 是拓尔微(TMI)推出的一款降压型(Buck)同步整流DC-DC转换器,面向空间受限、对效率和静态功耗有严格要求的电池供电与便携类应用。器件内置功率开关,工作电压范围宽,开关频率高,支持可调输出,整体集成度高、外围元件少,适合做单通道1A电源轨。

一、主要规格一览

  • 功能类型:降压型(同步整流)
  • 输入电压范围:2.5V ~ 5.5V
  • 输出电压范围:0.6V ~ 5.5V(可调)
  • 输出电流:最大1A
  • 开关频率:典型 2.5MHz
  • 静态电流 Iq:典型 40μA(低静态功耗)
  • 同步整流:内部同步MOSFET(无需外置二极管)
  • 开关管:内置
  • 输出通道数:1
  • 拓扑结构:降压式(Buck)
  • 工作温度:-40℃ ~ +125℃(结温)
  • 封装:SOT-23-5

二、核心优势

  • 低静态电流:40μA 的静态电流非常适合电池供电设备,可在待机模式下延长续航。
  • 高频开关(2.5MHz):允许使用小尺寸电感与陶瓷电容,显著缩小电源模块占板面积,利于紧凑型系统设计。
  • 同步整流与内置开关:提高转换效率、降低功耗和热量,同时简化外部布局与元器件选型。
  • 可调输出(0.6V 起):覆盖MCU、传感器、射频前端等多种电压需求,灵活性高。
  • 宽温工作范围:工业级温度范围适合多场景部署。

三、典型应用场景

  • 电池供电设备与便携终端(手持设备、便携式测试仪)
  • 物联网节点、无线传感器与电池供电传感器模块
  • 单片机/FPGA等核电源轨降压供电(低压核心供电)
  • 小功率背光或LED驱动(需限流或配合外部电路)
  • 工业控制、仪器仪表中的稳压模块

四、设计与布局建议

  • 电感选择:由于2.5MHz 高频,推荐使用 0.47μH ~ 2.2μH 高频封装电感,注意电流饱和与直流电阻(DCR)。
  • 输入/输出电容:优先使用低ESR陶瓷电容,输入侧 2.2μF10μF,输出侧 10μF47μF 作为起点,根据纹波与瞬态要求调整。
  • 反馈网络:输出电压通过外部分压反馈到 FB 引脚(参考电压约 0.6V),反馈电阻应靠近芯片并布局短回路。
  • 布局要点:开关节点走线短且宽,输入电容尽量靠近器件 VIN 和 GND 引脚,地线采用单点回流以降低噪声与散热阻抗。
  • EMI 与滤波:高频开关易产生辐射,必要时在开关节点增加小电阻或RC阻尼,输入侧可加共模/差模滤波器改善传导发射。

五、热管理与可靠性

SOT-23-5 封装在高输出电流或高输入电压差时会产生较大功耗,需关注PCB铜箔散热、加大GND层面积并考虑热沉路径。工作环境接近极限温度时,应评估长期热应力对输出稳定性的影响并留有裕量。

六、选型建议与注意事项

  • 若系统对待机功耗敏感,TMI3101C 的40μA静态电流是优势;若需要更大输出电流或更低压差,需比较同类更大电流器件。
  • 高开关频率带来器件小型化优势,但对布局与EMI 要求更高;在设计前进行电磁兼容与热仿真验证。
  • 参照器件数据手册进行详细参数校核(开关电流能力、效率曲线、软启动、保护功能等),并根据应用场景调整外部元件值。

总结:TMI3101C 以其高集成度、低静态电流及高开关频率,适合对体积与能耗敏感的便携与物联网设备,能在保证效率的同时显著减小电源模块尺寸。设计时关注布局、滤波与散热即可发挥其最佳性能。

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