WMSIC Electronic Components

TMI TMI33431

ModelTMI33431
PackageSOP-8
BrandTMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
TMI TMI33431
Type
TMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
TMI
Electronic Component
TMI33431
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.179g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258500774
Operating Temperature
40℃~+150℃
Operating Voltage
4.5V~30V
Switching Frequency
570kHz
Electronic Component
Electronic Component
Output Current
2.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TMI33431 产品概述

一、产品简介

TMI33431 是拓尔微(TMI)推出的一款降压型同步整流开关稳压器,采用降压拓扑并集成功率开关管,工作电压范围宽(4.5V~30V),可提供最高2.5A输出电流,开关频率为570kHz,输出为可调型,适用于对效率、体积和成本有综合要求的电源设计。器件工作温度覆盖广(-40℃~+150℃),封装为 SOP-8,便于批量生产与手工焊接。

二、主要参数与特性

  • 功能类型:降压型(Buck),同步整流(内置下管)
  • 输入电压:4.5V ~ 30V
  • 输出电流:最高 2.5A(连续)
  • 开关频率:570kHz(固定)
  • 输出类型:可调(通过外部分压电阻设置输出电压)
  • 开关管:内置高/低端MOSFET,降低外部器件复杂度
  • 工作温度:-40℃ ~ +150℃
  • 封装:SOP-8(适合工业应用和中功率板级转换)

三、优势与适用场景

  • 高集成度:内置功率管,外部只需少量电感、电容和反馈电阻,简化系统设计。
  • 中高效率:采用同步整流,轻载到中载效率表现良好,适合对能耗敏感的应用。
  • 高频率:570kHz 开关频率在尺寸与效率间取得平衡,可使用体积较小的磁性件。
  • 适用场景:工业控制、通信设备、车载电子(需遵循车规额外验证)、消费电子、嵌入式系统的主从供电或点对点电源。

四、设计建议与注意事项

  • 外围器件选择:根据输出电流与纹波要求选择合适的电感(建议根据570kHz计算饱和电流和DCR),输入/输出电容选低ESR类型以降低纹波和稳定性问题。
  • 反馈网络:输出电压通过外部分压电阻设置,注意反馈网络的阻抗与器件内部参考源匹配,必要时加入小并联补偿元件以保持环路稳定。
  • 布局要点:靠近器件布置输入电容,缩短开关回路回流路径,尽量减小寄生电感;输出电流走线加宽,热流回流良好。
  • 热管理:在高输入压差或高负载时关注芯片功耗,必要时采用散热铜箔或散热片以降低结温,保证长期可靠性。
  • 保护机制:常见应用中建议配置过流、过温及软启动等保护措施,具体实现与器件内部保护策略请参照官方资料。

五、封装与热性能

SOP-8 封装便于标准化生產和焊接,封装散热能力受限于PCB铜面积与焊盘设计。建议在器件底部和周围增加散热铜箔,合理设计热过孔以提升热传导,必要时在PCB底层布置散热平面。

六、选型与技术支持

在工程开发前,建议获取并仔细阅读 TMI33431 的完整数据手册,核对引脚定义、动态特性、保护门限与推荐外围元件清单。若用于车规或关键任务场景,请联系厂商确认额外验证或可替代型号。厂商技术支持通常能提供参考设计、布局示意图及BOM,便于快速评估与量产移植。

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