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TMI TMI7003C
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TMI TMI7003C
- Type
- TMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TMI
- Electronic Component
- TMI7003C
- Electronic Component
- 1
- Package
- QFN-20-EP(3x3)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.018g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0226163420
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 2.5V~5.5V
- Switching Frequency
- 1.5MHz
- Electronic Component
- Electronic Component
- Output Current
- 1.5A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TMI7003C 三路可调同步降压稳压器概述
一、产品简介
TMI7003C 是拓尔微（TMI）推出的一款三路可调输出同步整流降压型开关稳压器，采用降压拓扑、内置开关管，工作电压范围为 2.5V 至 5.5V，开关频率为 1.5MHz，工作结温范围 -40℃ 至 +125℃（@TJ），封装为 QFN-20-EP（3×3）。器件集成度高、体积小，适合多路供电的便携或嵌入式系统。
二、主要性能特点
- 三路独立输出，输出电压可调，支持外部分压反馈实现任意设定电压（在器件允许范围内）。
- 同步整流结构：内置下桥场效应管，提升转换效率，降低热损耗，无需外接肖特基二极管。
- 高开关频率（1.5MHz）：允许使用体积更小的电感与输出滤波电容，有利于实现高密度 PCB 布局和小型化方案。
- 内置开关管设计：简化 BOM，便于快速设计和量产。
- 宽工作温度：-40℃~+125℃（TJ），适用于工业及车载电子周边的温度要求（请参照实际应用条件和热设计）。
三、典型应用场景
- 多路供电的嵌入式主板、单板计算机（MCU、DSP、FPGA 供电）。
- 移动通信设备与物联网终端的主/辅助稳压电源。
- 消费类电子、工业控制模块、摄像模组和摄像头供电。
- 电源管理模块（PMIC）或电源子系统集成方案。
四、封装与热管理
QFN-20-EP（3×3）小型封装利于占板空间最小化，底部导热焊盘（EP）必须焊接至 PCB 大面积散热层，并采用多孔过孔（via）打通顶层至内层/底层散热层以降低结-壳温度。高频切换与同步整流意味着布局与散热对性能影响显著，应留足敷铜面积并做好散热设计。
五、设计与使用建议
- 输出电压通过外接反馈电阻网络设置，注意反馈节点的走线和旁路，避免噪声耦合。
- 选用低 ESR 陶瓷电容作输入/输出滤波，输入侧需靠近 VIN 引脚放置去耦电容以抑制开关尖峰。
- 由于 1.5MHz 频率较高，磁性元件和电容应选择在该频段损耗低的产品，并注意电感电流能力与饱和电流余量。
- 布局要点：最短的开关回路（开关管、频率回路、输入电容）和清晰的地平面，避免敏感模拟信号靠近开关节点。
六、典型外设选型与布局要点
- 电感：选择针对 1.5MHz 优化的功率电感，DCR 低、额定电流高于最大输出电流。
- 输入/输出电容：多并联陶瓷电容以减少 ESR/ESL，必要时在输出加入薄膜电容改善瞬态。
- PCB：底部焊盘打通多孔，输入电容与开关节点靠近放置，反馈网络靠近 FB 引脚并回到器件地。
七、注意事项与可靠性
在高温或高负载工况下，应留有充分的热裕量并按实际应用评估降额设计；同步整流结构在轻载或连续导通模式下的工作特性需参考器件详表。为确保最终性能与可靠性，请在产品设计阶段参考 TMI7003C 官方数据手册和参考设计，并进行系统级仿真与热验证。
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