WMSIC Electronic Components

UNI-ROYAL 0805W8J0200T5E

Model0805W8J0200T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8J0200T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8J0200T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.027g
Electronic Component
20Ω
Electronic Component
1
Electronic Component
BM0257342051
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8J0200T5E 产品概述

一、产品简介

0805W8J0200T5E 为 UNI-ROYAL(厚声)品牌的贴片厚膜电阻,封装为 0805(约 2.0 × 1.25 mm)。标称阻值 20 Ω,精度 ±5%,额定功率 125 mW,额定工作电压 150 V,温度系数(TCR)±200 ppm/℃,工作温度范围 -55 ℃ 至 +155 ℃。该器件采用厚膜工艺制备,结构稳定,适用于常见 SMT 组装流程。

二、主要性能参数

  • 电阻类型:厚膜电阻(Thick Film)
  • 阻值:20 Ω ±5%
  • 额定功率:125 mW(环境与 PCB 布局相关需按降额曲线使用)
  • 额定工作电压:150 V(器件最高耐压,注意与功率限制同时考虑)
  • 温度系数:±200 ppm/℃(20 Ω 时每摄氏度约变化 ±0.004 Ω)
  • 环境温度范围:-55 ℃ ~ +155 ℃
  • 封装:0805(约 2.0 × 1.25 mm)
  • 品牌:UNI-ROYAL(厚声)

三、电气特性与计算(典型工程参考)

  • 基于额定功率 P=125 mW 与 R=20 Ω,可计算通过器件的最大稳态电流:Imax = sqrt(P/R) ≈ 0.079 A(约 79 mA)。
  • 基于功率的最大允许电压:Vmax_from_P = sqrt(P·R) ≈ 1.58 V。
    注:额定工作电压 150 V 表示器件绝缘/耐压能力,实际使用时必须同时满足功率约束与电压约束,二者以更严格者为准。

四、封装与机械信息

0805(公制 2012/毫米标称约 2.0 × 1.25 mm)为常见中小尺寸贴片电阻,适配主流 SMT 生产线。厚膜电阻端面通常有可焊金属化端接,兼容回流焊工艺。具体焊盘尺寸、锡膏量及回流曲线请参考供应商推荐的 PCB 布局与工艺手册。

五、典型应用场景

适用于各类空间受限且电流、功率要求较低的电子设备,如消费电子信号回路、电源分流(低电流)、传感器前端、滤波与偏置网络、便携设备与通信终端中的低功耗电阻需求。

六、设计与使用注意事项

  • 功率降额:在高环境温度或热导不良的 PCB 区域,须按厂家降额曲线进行功率限制。
  • 电压与功率并用时注意:尽管器件额定工作电压高达 150 V,但在高电压下实际允许功率可能受限,务必同时校核电压与功率温升。
  • 焊接与可靠性:兼容常规 SMT 回流,建议遵循厂家回流曲线与 IPC 焊盘规范以降低热应力与机械应力。
  • 温漂与配对:TCR ±200 ppm/℃ 对精密测量或温度敏感电路影响明显,必要时采用配对或采用低 TCR 器件替代。

七、品质与采购建议

UNI-ROYAL(厚声)为成熟元器件供应商,该型号适合批量 SMT 贴装。常见包装形式为卷带(Tape & Reel),具体包装、认证(如 RoHS)与衰减/寿命试验数据请向供应商索取完整规格书与检验报告,以便在量产与可靠性验证阶段使用。

如需我为您整理该型号的 PCB 焊盘推荐尺寸、回流焊建议曲线或与其它阻值/精度的替代型号比较,我可以继续提供详细资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.