WMSIC Electronic Components

UNI-ROYAL 0805W8J0511T5E

Model0805W8J0511T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8J0511T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8J0511T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.027g
Electronic Component
510Ω
Electronic Component
1
Electronic Component
BM0257341636
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8J0511T5E — UNI-ROYAL 厚膜贴片电阻(0805, 510Ω ±5%)

一、产品简介

0805W8J0511T5E 是 UNI-ROYAL(厚声)系列的厚膜贴片电阻,标准 0805(2012公制)封装,标称阻值 510Ω,公差 ±5%。额定功率为 125mW,工作电压 150V,温度系数 ±100ppm/℃,工作温度范围 -55℃ 至 +155℃。该系列面向通用电子设备的表面贴装应用,兼顾成本与可靠性,适合中低功耗电路的阻值元件需求。

二、主要参数

  • 阻值:510Ω
  • 精度:±5%(J级)
  • 功率:125mW(额定)
  • 最高工作电压:150V
  • 温度系数:±100ppm/℃
  • 工作温度:-55℃ ~ +155℃
  • 封装:0805(2012)贴片
  • 结构类型:厚膜电阻

三、结构与封装说明

0805 封装尺寸小而通用,便于自动贴装与回流焊工艺。厚膜工艺通过在陶瓷基体上印制电阻浆料并烧结形成,端接采用金属化处理以利焊接。此类电阻在体积、成本与温度稳定性之间取得平衡,适合高密度线路板布线需求。

四、性能特性

  • 稳定的阻值与较宽的工作温度范围,适合工业级环境;
  • 温度系数 ±100ppm/℃,温度变化对阻值影响可接受,符合多数模拟与数字电路设计要求;
  • 额定功率 125mW 在 0805 尺寸中为常见值,需留意散热与降额使用;
  • 良好的可焊性与自动贴装兼容性,适合批量生产。

五、典型应用场景

适用于消费电子、通信设备、工业控制、仪表与传感器前端等应用中作为分压、限流、偏置与拉低/拉高等一般用途电阻。适合对功耗和体积有中等要求的线路。

六、使用与焊接建议

  • 推荐采用标准 SM T 回流焊工艺进行贴装;为保证性能,回流工艺参数请参照生产厂商的焊接曲线;
  • 在 PCB 布局中应考虑散热路径与周围元件热耦合,避免在高温元件旁叠层布置;
  • 对于长时间高功率应用,建议降额使用或加大散热面积以延长寿命。

七、采购与包装

产品型号:0805W8J0511T5E,品牌:UNI-ROYAL(厚声)。常见供应形式为卷盘包装,适配自动贴装机。订购时请确认阻值批号、包装数量与交货期,并与供应商确认是否提供质量与可靠性测试报告。

八、注意事项与可靠性

  • 在极端温度或重复热循环环境下,阻值可能发生小幅漂移,设计时应预留足够裕度;
  • 对于需要更高精度、低温漂或高功率的场合,应考虑金属膜、合金膜或更大封装的电阻替代;
  • 保存时避免潮湿与机械应力,贴片在装配前应避免受潮污染以免影响焊接质量。

如需详细焊接曲线、可靠性测试数据或样片评估,可联系供应商提供更完整的技术资料与样品支持。

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