Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0603WAF9101T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAF9101T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAF9101T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 9.1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0228745299
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAF9101T5E 产品概述 — UNI-ROYAL（厚声）0603贴片电阻 9.1KΩ ±1%
一、产品简介
0603WAF9101T5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装尺寸为 0603（1.6 mm × 0.8 mm），额定阻值 9.1 kΩ，公差 ±1%。该器件采用厚膜工艺制成，设计用于表面贴装工艺，适配现代化SMT流水线与常规无铅回流焊工艺，兼顾体积小、性能稳定与批量生产成本优势。
二、主要电气与环境参数
- 阻值：9.1 kΩ（±1%）——符合 1% 系列常用阻值规范（E96系列值）。
- 功率额定：0.10 W（100 mW）——在良好散热条件下工作，适合低功耗电路。
- 最大工作电压：75 V（额定使用电压上限，请按实际工作条件评估）
- 温度系数（TCR）：±100 ppm/°C——在宽温变化下保持良好阻值稳定性。
- 工作温度范围：-55 ℃ ～ +155 ℃，可在工业级温度范围内长期工作。
- 结构：厚膜电阻，陶瓷基片与金属端接，适合自动化贴装和回流焊接。
三、可靠性与性能特点
- 稳定性良好：厚膜工艺在常规电气与温湿循环测试中表现出较小的阻值漂移，适合长期使用。
- 良好的焊接兼容性：适配无铅回流工艺，耐回流焊温度，适用于常见PCB装配流程。
- 耐环境性：可耐受工业级温度与一般湿热、温度循环等应力，适合多种环境应用。
- 小型化设计：0603封装在空间受限的移动设备、便携与高密度电路中具有优势。
四、焊接与应用建议
- 推荐使用标准无铅回流温度曲线（遵循IPC/JEDEC建议），避免重复高温冲击。
- 在高温或散热受限场合建议降额使用（减小电流与功耗），以延长使用寿命并保证长期稳定性。
- 贴装过程注意防止过度机械应力与刮擦，焊盘设计参考0603常规封装过孔与焊盘尺寸，确保可靠焊接。
五、典型应用场景
- 移动设备与便携式电子产品（偏低功耗分压、偏置、拉/下拉电阻等）
- 消费类电子、家电控制板的通用信号与电路设计
- 工业控制、通信设备与模块化电源中的阻值匹配与限流场合
- 物联网节点、传感器前端等对体积与成本敏感的电路应用
六、选型与采购注意
- 若应用对温漂与长期稳定性要求更高，可考虑低TCR规格或薄膜/金属膜电阻替代；若需汽车级认证，应选择有AEC-Q200等认证的器件。
- 采购时请确认包装形式（盘带/卷装）、最小包装数量与出货认证文件（RoHS/REACH等）以便于生产对接。
以上为 0603WAF9101T5E 的产品概述，如需器件的详细电气特性曲线、封装尺寸图或可靠性测试报告，可提供更具体的技术资料与样品支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
