WMSIC Electronic Components

UNI-ROYAL 0402WGF2212TCE

Model0402WGF2212TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF2212TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF2212TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
22.1kΩ
Electronic Component
10
Electronic Component
BM0257242488
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF2212TCE 产品概述

一、产品简介

0402WGF2212TCE 为 UNI-ROYAL(厚声) 系列贴片厚膜电阻,阻值 22.1kΩ,精度 ±1%,额定功率 62.5mW(1/16W),工作电压 50V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ ~ +155℃。封装为 0402(约 1.0mm × 0.5mm),适用于高密度 SMT 布局,兼顾体积与性能的平衡。

二、主要参数与性能解读

  • 电阻类型:厚膜电阻,具有良好的通用性与成本优势。
  • 阻值与精度:22.1kΩ,±1% 适合要求中高精度的分压、偏置与信号处理电路。
  • 功率与电压限制:额定功率 62.5mW。按功率计算的持续允许电压 Vmax = sqrt(P·R) ≈ 37.2V,低于标称工作电压 50V,因此在设计时应以功率限制为准,避免在接近 50V 的电压下长期工作。
  • 温漂与环境适应:TCR ±100ppm/℃,在较大温度变化时阻值会有可预测的漂移,适合一般环境与工业级温度范围。-55℃~+155℃ 的温度等级满足多种严苛应用场景。

三、典型应用场景

  • 移动设备、可穿戴与消费电子中的偏置与分压网络;
  • IoT 节点、传感器接口与信号调理电路;
  • 工业控制和仪表中的中低功率电阻应用;
  • PCB 密度高、空间受限的产品线,需减小封装面积时首选。

四、设计与使用建议

  • 功率降额:在高温环境下遵循厂方功率降额曲线,避免在高温下满载工作;若无厂方曲线,建议按常规从 70℃ 开始线性降额至最高工作温度。
  • 电压与功耗:实际设计中以功率计算出的允许电压为准(上文示例约 37.2V),若有瞬态高压应加保护或选用更高功率/更高电压等级器件。
  • 温漂管理:对阻值稳定性要求高的场合,可考虑并联或采用更低 TCR 的薄膜或金属膜电阻替代。

五、安装与可靠性注意事项

  • 兼容常规回流焊工艺,但请参考供应商回流温度曲线以避免长期可靠性隐患;
  • 防潮干燥保存,避免在高湿环境下长期暴露;
  • 焊盘设计应兼顾热量散发与机械强度,0402 封装对焊接工艺敏感,需严格控制焊膏量与回流曲线。

六、选型与替代建议

  • 若需更低温漂或更高稳定性,建议选用薄膜或金属膜电阻;
  • 若电路存在高瞬态或较高持续电压,应选择更高功率或更高额定电压的封装(如 0603/0805 或更大)。
  • 采购时确认生产批次与质量认证,必要时要求样品测试以验证在目标应用环境下的表现。

总结:0402WGF2212TCE 以小型封装、1% 精度与适中的温漂特性,适合空间受限且对精度有一定要求的中低功率电路。设计时应重视功率与电压的匹配、温漂影响及可靠的回流焊工艺,以确保长期稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.