Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8J0471T5E 为 UNI-ROYAL(厚声)出品的贴片厚膜电阻,封装为 0805(约 2.0 × 1.25 mm),阻值 470Ω,精度 ±5%(J),额定功率 125 mW,工作电压标称 150 V,温度系数 ±100 ppm/℃,工作温度范围 -55℃~+155℃。该系列为通用型表面贴装电阻,兼顾成本与性能,适合大批量的消费类与工业电子产品。
厚膜工艺稳定可靠,耐湿热、耐振动性能良好,适用于潮湿及振动环境的通用电子设计。工作温度覆盖-55℃至+155℃,满足汽车电子(部分非关键部位)、工业控制、通信设备等多种环境要求。长期可靠性与寿命依赖于实际工作功率、环境温度和 PCB 热管理。
0805 小型贴片封装,建议采用标准 SMT 回流焊工艺(优先无铅回流),遵循供应商的回流温度曲线以避免过热。贴片焊盘设计应保证良好焊接湿润和足够的机械支撑,同时考虑热扩散以利散热。清洁和焊剂残留处理请遵循厂商推荐流程。
适用于:电源分流、限流、拉/下拉电阻、阻抗匹配、信号调理与一般功能电阻网络。常见于消费电子、工业控制、通信设备、仪表及照明驱动等场景。
如需更详细的降额曲线、寿命检测数据或回流焊工艺参数,可联系供应商索取完整数据手册与应用指导。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products