Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4F5101T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F5101T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F5101T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 5.1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257245697
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F5101T5E 产品概述
一、产品简介
1206W4F5101T5E 是 UNI-ROYAL（厚声）系列的贴片厚膜电阻，封装为 1206（3.2×1.6 mm），阻值 5.1 kΩ，精度 ±1%，额定功率 250 mW，额定工作电压 200 V。该系列以成本效益高、工艺成熟著称，适合大批量表面贴装（SMT）应用。
二、主要电气参数
- 阻值：5.1 kΩ（5101）
- 精度：±1%（F）
- 额定功率：250 mW（无风冷条件或参考厂方条件）
- 最高工作电压：200 V
- 温度系数（TCR）：±100 ppm/°C
- 工作温度范围：-55°C ～ +155°C
- 型式：厚膜（thick film）贴片电阻
三、机械与封装
- 封装尺寸：1206（公制 3216）约 3.2 mm × 1.6 mm，厚度约 0.5 mm（典型值以厂方数据为准）。
- 安装方式：表面贴装（SMD），兼容自动贴片与回流焊工艺。常见包装为盘带（Tape & Reel），便于 SMT 贴装线使用。
四、应用场景
该型号适用于对阻值精度与稳定性有中等要求的通用电子电路，例如：
- 信号分压与偏置网络
- 模拟前端、滤波器与耦合电路
- 工业控制与通讯设备的通用限流/分压元件
- 消费类电子和家电中对功率与体积有平衡需求的场合
五、选型与使用注意事项
- 功率与温度：在高温环境下需考虑功率降额，实际使用时请参考厂商提供的功率降额曲线并留有裕量。
- 冲击与脉冲：厚膜电阻对瞬态脉冲能量的承受力有限，如用于脉冲或高能场合需评估脉冲功耗与热冲击。
- 焊接工艺：建议遵循 UNI-ROYAL 的回流焊推荐曲线，常规无铅回流温度峰值按行业标准控制，避免过度加热以保证可靠性。
- 布局与散热：若在散热不足的 PCB 区域使用，应适当增加铜箔面积或远离热源以降低结温，延长寿命。
六、可靠性与品质保障
UNI-ROYAL 为成熟的元件制造商，产品通过常规的耐焊、耐潮、温度循环与机械应力测试。实际长期漂移、寿命与可靠性指标请参阅官方规格书与认证报告，以满足关键应用的设计要求。
七、总结
1206W4F5101T5E 为一款性能均衡的厚膜贴片电阻，适合对成本、体积与中等精度要求兼顾的电子设计。阻值 5.1 kΩ、±1% 精度及 250 mW 的功率等级，使其在信号处理、偏置与通用限流场合具有良好适配性。选型时建议结合工作温度、散热条件与脉冲负载特性，参照厂商完整规格书以确保电路长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
