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UNI-ROYAL 0201WMF4701TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF4701TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF4701TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 4.7kΩ
- Electronic Component
- 50
- Electronic Component
- BM0231141835
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF4701TEE 产品概述
一、产品简介
0201WMF4701TEE 是 UNI-ROYAL（厚声）推出的一款高密度贴片厚膜电阻，标准阻值为 4.7kΩ，公差为 ±1%。该器件采用 0201（约 0.6×0.3 mm）超小封装设计，适用于对体积和布局密度有严格要求的现代电子产品。额定功率 50 mW，最大工作电压 25 V，温度系数（TCR）为 ±200 ppm/℃，工作温度范围为 -55℃ 至 +155℃。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：4.7 kΩ（4701）
- 精度：±1%
- 额定功率：50 mW（在标准环境下）
- 最大工作电压：25 V
- 温度系数：±200 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0201（超小型贴片）
- 品牌：UNI-ROYAL（厚声）
- 型号：0201WMF4701TEE
三、产品特点
- 超小体积：0201 封装可显著提升 PCB 布局密度，适合微型化产品设计。
- 精度优势：±1% 精度满足一般精密分压、采样、阻抗匹配等应用需求。
- 稳定性：±200 ppm/℃ 的温度系数在温度变化环境中表现出良好的阻值稳定性。
- 通用可靠性：宽工作温度范围适配工业级温度需求，适合在恶劣环境下长期工作。
四、典型应用场景
- 可穿戴设备与智能手环、耳机等对空间敏感的消费电子。
- IoT 终端、微型传感器节点、智能卡与微控制器外围电路。
- 高频/高密度信号链中的分压、阻抗配对与偏置网络（需注意功率与电压限制）。
- 手机、平板等便携设备的细密 PCB 布局。
五、安装与使用注意事项
- 功率与电压：请确保实际工作条件下的功耗及电压不超过器件额定值；高温环境下建议按厂商推荐的降额曲线处理。
- 回流焊适配：0201 尺寸对焊接工艺敏感，推荐使用稳定的回流曲线与合适的焊盘设计，避免长时间高温暴露。
- 焊盘与贴装：建议按厂商推荐的 PCB 焊盘尺寸与贴装参数进行设计，减少虚焊与偏位风险。
- 处理与清洗：器件体积极小，自动贴装时注意防止静电与机械损伤；清洗时避免强腐蚀性溶剂对涂层影响。
六、储存与可靠性
- 储存条件：建议在干燥、常温、避光环境中保存，避免长时间潮湿与极端温度。
- 包装形式：通常以卷带（Tape & Reel）方式供货，便于 SMT 自动贴装。
- 可靠性建议：在设计阶段进行温度循环、湿热与振动评估，验证在目标应用环境下的长期稳定性。
七、订购信息与备注
型号：0201WMF4701TEE；品牌：UNI-ROYAL（厚声）；封装：0201；阻值/精度：4.7kΩ ±1%。如需样品、批量报价或封装详细尺寸图、回流曲线与推荐焊盘，请联系供应商获取原厂技术资料与检验报告。使用时请结合具体应用对功率、温度和热沉条件进行工程验证。
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