WMSIC Electronic Components

UNI-ROYAL 0603WAJ0152T5E

Model0603WAJ0152T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAJ0152T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAJ0152T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
1.5kΩ
Electronic Component
10
Electronic Component
BM0257341732
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAJ0152T5E 产品概述

一、产品简介

0603WAJ0152T5E 为 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装尺寸为 0603(1608公制,约1.6mm × 0.8mm)。标称阻值 1.5kΩ,公差 ±5%(J),额定功率 100mW,允许工作电压 75V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ ~ +155℃。该器件为通用型 SMD 芯片电阻,适用于体积受限且对成本敏感的大批量消费类和工业电子产品。

二、主要技术参数

  • 阻值:1.5kΩ
  • 精度:±5%(J)
  • 功率:0.1W(100mW)
  • 允许工作电压:75V(额定);但受功耗限制,实际跨端最大电压应满足 P = V^2/R,即 Vmax ≈ √(0.1W×1500Ω) ≈ 12.25V,否则容易因功耗过大而过热。
  • 温度系数(TCR):±100ppm/℃(约为每℃±0.01%)
  • 工作温度范围:-55℃ ~ +155℃
  • 制程:厚膜(成本低、适用于通用电路)
  • 封装:0603(EIA),适配高速贴片机生产

三、产品特点

  • 小型化:0603 封装节省 PCB 面积,适合高密度布局。
  • 成本效益高:厚膜工艺在通用阻值段价格经济,适合量产。
  • 温度稳定性满足一般电子设备要求,±100ppm/℃ 对于大多数信号电路和分压、上拉/下拉用途已足够。
  • 宽温度范围:-55℃ 至 +155℃,可应用于常见工业与消费类环境。
  • 可靠性:适配常规回流焊工艺,机械与热循环性能良好,满足一般电路板可靠性需求。

四、典型应用场景

  • 消费电子:手机配件、遥控器、便携式设备中的分压、上拉/下拉与限流电阻。
  • 工业控制:传感信号调理和非关键电源回路。
  • 通信设备:滤波网络、偏置电路及参考分压。
  • 一般电子产品与教学样板:适用于对精度、功耗要求不高的场合。

五、使用注意事项与焊接建议

  • 电压与功率限制:尽管标称允许工作电压为 75V,但因功率限制实际能承受的跨端电压以 Vmax ≈ 12.25V 为准。请按照 P=V^2/R 计算工作条件下的消耗,防止过热失效。
  • 功率下降与散热:在高环境温度下需考虑功率降额,建议在较高环境温度或受限散热条件下将连续功耗控制在额定功率的 50%~70% 范围内以延长寿命。
  • 焊接工艺:建议采用无铅回流工艺,峰值温度参考 260℃ 左右,峰值时间尽量短(例如不超过 10s),并避免多次重复高温。具体工艺以 PCB 及混合元件的最高承受温度为准。
  • 储存与防潮:常规存放于干燥环境,避免长期潮湿、高温或强腐蚀气体环境。
  • 机加工与贴装:0603 为小尺寸器件,贴装时注意避免过大的机械压力,封装端电极方向及焊盘设计按制造商推荐尺寸布局。

六、订购与包装

  • 型号:0603WAJ0152T5E(对应 0603 封装,1.5kΩ,±5%)
  • 包装:一般提供卷带(Tape & Reel)包装,适配自动贴片生产线。
  • 采购建议:在设计环节确认最大工作电压与实际功耗,若电路中存在较大电压或持续功耗接近 100mW,建议选用功率更高或精度/温漂更优的型号以提高可靠性。

如需器件详细的电气老化、温度循环与环境试验数据(例如 IEC/JEDEC 认证测试报告)或回流曲线与封装尺寸详图,我可协助查询并提供更详细的技术资料。

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