Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4J0200T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4J0200T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4J0200T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 20Ω
- Electronic Component
- 1
- Electronic Component
- BM0257342042
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4J0200T5E 产品概述
一、产品简介
1206W4J0200T5E 为 UNI-ROYAL（厚声）系列贴片厚膜电阻，封装为 1206（约 3.2 × 1.6 mm），标称阻值 20Ω，阻值精度 ±5%（J 型），额定功率 250 mW，额定工作电压 200 V，温度系数 ±100 ppm/℃，工作温度范围 -55℃ ~ +155℃。该器件定位通用贴片电阻，适用于空间有限但需可靠性能的一般电子电路。
二、主要参数
- 类型：厚膜贴片电阻
- 阻值：20Ω
- 精度：±5%（J）
- 额定功率：0.25 W（在规定环境下）
- 额定电压：200 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度：-55℃ ~ +155℃
- 封装：1206（3216公制）
三、结构与封装要点
厚膜工艺结合陶瓷基片与金属端接，适应自动贴装与回流焊工艺。1206 尺寸兼顾功率耗散与 PCB 布局密度，适合常见贴片生产线处理。焊接推荐遵循 J-STD-020 回流曲线，避免超温或长时间高温暴露。
四、性能与可靠性
产品在常规环境下具有良好稳定性与可重复性。温度系数 ±100 ppm/℃ 适用于一般温度变化场景，但对高精度温度敏感电路应选择低 TCR 型号。建议遵循功率降额规则：高温环境下按厂商曲线线性降额使用，避免长期满载运行。建议在关键可靠性场合参考厂方具体试验数据（如负荷寿命、温度循环、湿热老化）。
五、典型应用
适用于消费电子、工业控制、电源滤波与限流、信号调理及通用分压/上拉下拉电路。20Ω 阻值在绕组阻尼、输入限流和 RC 阻尼网络中常见。
六、选型与使用建议
- 如需更高精度或更低 TCR，请选用薄膜或金属膜低温漂产品。
- 布局时注意散热路径和焊盘尺寸以保证功率散热。
- 严格控制焊接温度与回流时间，避免粘锡或裂纹。
- 设计时检查最大工作电压与实际电路电压峰值是否匹配。
七、采购与质量保证
订购时请确认完整料号 1206W4J0200T5E 及品牌 UNI-ROYAL（厚声），并向供应商索取最新规格书与可靠性测试报告，核实批次一致性与追溯信息，以满足生产与质量管理要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
