WMSIC Electronic Components

UNI-ROYAL 0201WMJ0472TEE

Model0201WMJ0472TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMJ0472TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMJ0472TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
4.7kΩ
Electronic Component
50
Electronic Component
BM0257242284
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMJ0472TEE 产品概述

0201WMJ0472TEE 是 UNI-ROYAL(厚声)系列厚膜贴片电阻中的超小型通用型号,标称阻值 4.7kΩ,精度 ±5%,额定功率 50mW,额定工作电压 25V,温度系数 ±200ppm/℃,工作温度范围 -55℃~+155℃。该器件以 0201 超小封装为主,适合高密度、多层板的微型电子产品设计。

一、主要技术参数

  • 电阻类型:厚膜(Thick Film)贴片电阻
  • 阻值:4.7kΩ(标称)
  • 精度:±5%
  • 额定功率:50mW
  • 额定工作电压:25V
  • 温度系数(TCR):±200ppm/℃
  • 工作温度:-55℃~+155℃
  • 封装:0201(超小型贴片封装)
  • 品牌:UNI-ROYAL(厚声)

二、产品特点

  • 超小封装,节省 PCB 面积,适合高密度布局。
  • 厚膜工艺,成本低、性能稳定,适用于大批量通用设计。
  • 宽工作温度范围,适应工业级温度环境。
  • TCR ±200ppm/℃ 对于大多数数模分流、偏置网络具有良好温漂控制。
  • 容易实现自动化 SMT 贴装与回流焊接。

三、典型应用场景

适用于便携式消费电子、无线通信模块、物联网终端、数模混合电路中的上拉/下拉、电阻分压、限流、偏置与阻尼网络等对阻值精度要求不高但空间受限的场合。

四、封装与机械注意

0201(常见外形约 0.6mm × 0.3mm)为业界超小封装,实际尺寸与焊盘推荐应以厂方尺寸图为准。因体积极小,贴装与检测对工艺与设备要求较高,建议使用适配 0201 的印刷模板、贴片机和 AOI 检测方案。

五、焊接与使用建议

  • 推荐采用标准 SMT 回流工艺,遵循厂商给出的回流温度曲线以避免过热或热冲击。
  • 在设计时考虑功率余量与热散逸路径,避免在高温环境下长期满载工作。
  • 装配与维修时注意防静电、防机械挤压与过度弯曲引起的应力集中。

六、可靠性与采购提示

  • 厚膜工艺具有良好的一致性与成本优势,但在要求极高精度或低噪声的场合应选择薄膜或金属膜产品。
  • 常见包装形式为卷带(Reel),便于 SMT 线自动化装配。采购时确认包装数量、批次及 RoHS/符合性文件。

总结:0201WMJ0472TEE 以其超小封装和稳定的厚膜工艺,适合空间受限且对阻值精度要求不高的通用电子应用。设计时应充分考虑功率余量、散热及贴装工艺,以保证长期可靠性。若需替代或批量应用,可与供应商确认更详细的机械图、电气老化数据和回流曲线。

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