WMSIC Electronic Components

UNI-ROYAL 0402WGF1153TCE

Model0402WGF1153TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF1153TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF1153TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
115kΩ
Electronic Component
10
Electronic Component
BM0257244950
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF1153TCE 产品概述

一、产品简介

0402WGF1153TCE 是 UNI-ROYAL(厚声)系列的一款贴片厚膜电阻,阻值 115kΩ,精度 ±1%,额定功率 62.5mW,最大工作电压 50V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ 到 +155℃。封装为 0402(约 1.0mm × 0.5mm),适合空间受限、高密度 PCB 设计。

二、主要参数

  • 阻值:115kΩ(±1%)
  • 电阻类型:厚膜(贴片)
  • 额定功率:62.5mW(25℃ 环境下)
  • 最大工作电压:50V
  • 温度系数(TCR):±100ppm/℃(典型)
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0402(SMD)
  • 品牌:UNI-ROYAL(厚声)

三、性能与特点

  • 精度高:±1% 公差适合多数模拟电路与精密分压、参考回路使用。
  • 体积小:0402 尺寸有利于高密度布局与微型设备集成。
  • 宽温范围与稳定性:-55℃ 至 +155℃ 的工作温度满足工业级应用需求,厚膜工艺在机械强度和抗热冲击方面表现良好。
  • 电压限制提示:尽管在标准条件下额定功率为 62.5mW,但受限于 最大工作电压 50V,设计中应按电压限制对功率进行换算和降额设计。

四、典型应用

适用于低功耗和空间受限的电子产品,如便携式设备、通信终端、传感器前端、滤波与偏置电路、分压网络与信号处理模块。由于 TCR 为 ±100ppm/℃,在对温漂要求不苛刻的精密场合中也能稳定工作。

五、设计与使用建议

  • 安装与焊接:建议采用标准 SMT 回流焊工艺,遵循供应商推荐的回流温度曲线,避免过长高温暴露以保护焊接质量与阻值稳定性。
  • PCB 布局:在靠近热源或大电流器件时应预留隔离区域,避免局部过热;焊盘尺寸参考厂商数据表以保证焊点可靠性。
  • 电压与功率核算:在高阻值场景下请优先核算跨端电压,不可仅以额定功率判断是否满足需求,若电压接近 50V,应考虑更高封装或分压方案。
  • 存储与处理:保持干燥环境,避免潮湿与长期阳光直射;贴片元件易丢失或受污染,建议使用抗静电操作。

六、可靠性与包装

厚膜工艺具有良好的抗振动、抗冲击和长期稳定性。标准包装为卷带(Tape & Reel),可按客户需求提供不同封装数量与供货方式。出货前通常经过电阻值筛选与外观检验,满足工业级可靠性要求。

结语:0402WGF1153TCE 以其小体积、高精度和宽温特性,适合对体积和性能有综合要求的电子产品。选型时应综合考虑电压限制与功率降额,以确保长期可靠运行。如需进一步技术参数或样品测试建议,建议参考 UNI-ROYAL 官方数据手册或联系供应商技术支持。

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