WMSIC Electronic Components

UNI-ROYAL 0603WAF2201T5E

Model0603WAF2201T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF2201T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF2201T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
2.2kΩ
Electronic Component
10
Electronic Component
BM0228059339
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF2201T5E 产品概述

一、产品简介

0603WAF2201T5E 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,封装为 0603(英制 0201mm),阻值 2.2kΩ,精度 ±1%。该器件为通用型低功率表面贴装电阻,适用于要求体积小、精度中等、长期稳定性的消费电子及工业电子产品。

二、主要参数

  • 电阻类型:厚膜电阻
  • 阻值:2.2kΩ
  • 精度:±1%
  • 额定功率:0.1W(100mW)
  • 额定工作电压:75V
  • 温度系数(TCR):±100ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0603(贴片)
  • 品牌:UNI-ROYAL(厚声)

三、产品特点

  • 小型化封装,节省线路板面积,适合高密度布板。
  • ±1% 精度满足大多数模拟与数字电路的分压、限流和偏置要求。
  • ±100ppm/℃ 的温漂在一般环境下提供较好的稳定性。
  • 良好的焊接适配性,适用于自动贴装与回流焊工艺。
  • 结构可靠,适应宽温区间,环境耐受性良好。

四、典型应用场景

  • 移动设备和便携式电子产品的偏置与限流电路。
  • 消费类电子(电视、机顶盒、音频设备)中的阻值网络。
  • 工业控制与仪器仪表的信号调理和分压回路。
  • 物联网终端、传感器前端及其他空间受限电路。

五、封装与焊接建议

  • 提供自动贴装用卷带包装(Tape & Reel),便于高速贴片机使用。
  • 推荐按照制造商推荐的回流焊曲线进行焊接,控制峰值温度和加热/冷却速率,以保证焊点质量与电阻特性稳定。
  • 在频繁热循环或高湿环境中,建议做可靠性验证并遵循 PCB 设计的热管理与应力缓解措施。

六、可靠性与质量

  • 采用成熟厚膜工艺,老化与长期漂移小,适合批量生产应用。
  • 出厂前通常经过阻值、精度、电阻率及外观检测。具体可靠性试验(如高温储存、温度循环、湿热测试)请参阅厂家出具的详细规格书。

七、订购与售后

  • 型号:0603WAF2201T5E(请在采购时确认完整型号及包装形式)。
  • 可按需提供样品与技术规格书,支持批量供货与质量追溯。
  • 有关合规(如无铅/RoHS)认证、回流焊工艺参数及可靠性数据,请向供应商或厂商获取最新资料以便设计与验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.