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UNI-ROYAL 0805W8F4700T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F4700T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F4700T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 470Ω
- Electronic Component
- 1
- Electronic Component
- BM0257245034
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F4700T5E 产品概述
一、产品简介
0805W8F4700T5E 为 UNI-ROYAL（厚声）系列薄膜贴片电阻，采用厚膜工艺制造，封装为0805（公制2012）。阻值为 470Ω，公差 ±1%（F 级），额定功率 1/8W（125mW），适用于对精度和可靠性有一定要求的表面贴装电路。
二、主要参数
- 阻值：470Ω
- 精度：±1%（F）
- 额定功率：125mW（1/8W）
- 最大工作电压：150V
- 温度系数（TCR）：±100ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 工艺：厚膜（Thick Film）
- 品牌：UNI-ROYAL（厚声）
- 封装：0805（约 2.0 mm × 1.25 mm）
- 常见包装：卷带（T5E）
三、封装与外形
0805（2012）封装体积小，适合高密度贴片组装。典型外形尺寸约 2.0 mm × 1.25 mm，厚度随制造公差略有差异。表面为金属端帽，便于回流焊连接。T5E 后缀常用于卷带包装，便于 SMT 贴片机直接取料。
四、性能特点
- 精度高：±1% 精度满足精密电阻网络、分压、测量回路等场景需求。
- 稳定性好：厚膜工艺结合 ±100ppm/℃ 的TCR，适合宽温度范围的应用。
- 小型化：0805 封装兼顾体积与散热，适用于空间受限的板级设计。
- 通用性强：额定电压 150V，能满足常见信号与低压电源系统的耐压要求。
- 制造与可靠性：符合行业常见的焊接和可靠性测试要求，适配无铅回流工艺。
五、典型应用
适用于移动设备、消费电子、工业控制、仪表、通讯设备和一般电子电路中的分压器、限流、上拉/下拉、电阻网络与信号调理等低功率场景。特别适合对尺寸与精度有要求的表面贴装设计。
六、可靠性与焊接建议
- 推荐采用无铅回流焊工艺，遵循厂商提供的回流曲线（建议峰值温度 ≤260℃，时间与梯度按 IPC/JEDEC 标准）。
- 存储与搬运时避免受潮、高温及机电静电（ESD）损伤。
- 在设计版图时预留合适焊盘与过孔，优化热分布以减少局部过热。
- 常规可靠性测试包括温度循环、湿热、负载寿命和焊接耐热等，建议在关键应用中结合实际测试验证。
七、订购信息与注意事项
购买时请确认完整料号、包装形式（卷带/盘带）与供货批次。对于批量生产或对温漂、长期稳定性有更高要求的应用，建议向供应商索取详细规格书、可靠性报告及回流焊曲线。若需替代型号或更高功率/更低TCR的器件，可咨询供应商推荐。
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