Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0603WAJ0750T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0603WAJ0750T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0603WAJ0750T5E
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.023g
- Electronic Component
- 75Ω
- Electronic Component
- 10
- Electronic Component
- BM0257624236
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0603WAJ0750T5E 产品概述
一、产品简介
0603WAJ0750T5E 为 UNI-ROYAL（厚声）品牌的厚膜贴片电阻，封装尺寸 0603（1608 公制），标称阻值 75Ω，公差 ±5%，额定功率 100mW，额定工作电压 75V。该器件适用于对体积和成本有严格要求的高密度表贴电路，常用作信号电路的阻抗控制、分压、限流与拉／下拉电阻等。
二、主要电气参数
- 阻值：75Ω ±5%
- 功率：100mW（额定）
- 最大工作电压：75V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ～ +155℃
三、结构与工艺特点
该产品采用厚膜五层工艺烧结，具有良好的批量一致性与稳定性。0603 小封装实现低占板面积，有利于现代小型化电子终端。厚膜工艺在抗冲击和可焊性上表现良好，适配标准回流焊工艺。
四、应用场景
适用于移动设备、消费电子、通信设备、工业控制及其他对体积、成本敏感的嵌入式系统。典型用途包括信号限流、分压网络、阻抗匹配与拉／下拉电阻等。由于额定功率有限，不建议用于大电流或高功耗场合。
五、使用与设计建议
- 在 PCB 布局时预留适当焊盘以保证良好散热与可焊性；对功率消耗接近额定值的应用应采用降额设计并参考厂方功率随温度变化曲线。
- 采用标准无铅回流焊工艺，遵循厂方推荐的温度曲线。
- 存储与搬运应避免潮湿、强酸碱及机械冲击，建议使用防潮包装并在规定期限内领用。
六、可靠性与选型要点
厚膜贴片电阻具有成熟的制造工艺与稳定的长期可靠性；选型时应关注功率余量、温度系数对电阻稳定性的影响以及焊接兼容性。如需更高精度或更低 TCR，可考虑金属膜或薄膜产品线。购买时确认批次、包装数量及相关认证资料以满足量产需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
