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UNI-ROYAL 0402WGF1302TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF1302TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF1302TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 13kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257341431
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF1302TCE 产品概述
一、产品简介
0402WGF1302TCE 为 UNI-ROYAL（厚声）出品的一款贴片厚膜电阻，标称阻值 13 kΩ，精度 ±1%，封装 0402（公制 1005 英制 0402）。该系列采用厚膜工艺制造，尺寸极小、成本效益高，适合高密度表面贴装（SMT）场合与大批量生产需求。
二、主要性能特点
- 阻值：13 kΩ，精度等级 ±1%，适用于对阻值稳定性有一定要求的信号与分压电路。
- 功率额定：62.5 mW，适合低功耗电路或作为反馈/偏置用阻。
- 最高工作电压：50 V（请在设计时注意电压裕度与脉冲条件）。
- 温漂（TCR）：±100 ppm/°C，温度稳定性适中，适用于一般工商业电子设备。
- 工作温度范围：-55 ℃ ~ +155 ℃，可在宽温区间可靠工作。
三、应用场景
- 消费电子中作为信号分压、偏置与阻抗匹配元件；
- 工业控制与通信设备中低功率测量、滤波与参考电路；
- 便携式与物联网终端中要求尺寸小、精度中等的电阻定位。
四、封装与包装
0402 极小封装，裸片通常不做外显标识（尺寸限制），出厂以卷带（tape & reel）形式供 SMT 自动贴装使用，便于高速贴片机加载。选型时请确认 PCB 焊盘尺寸与回流工艺兼容。
五、可靠性与测试
产品采用厚膜烧结工艺，具有良好的可焊性与批量一致性。出厂通常通过常规电气与可靠性试验，包括阻值检验、焊接热循环、湿热试验与机械振动/冲击测试等。设计使用时建议参考厂商完整数据手册以获取更详尽的可靠性数据与寿命曲线。
六、选型与注意事项
- 功率热降额：实际可用功率受 PCB 散热、环境温度与封装尺寸限制，建议在高温或密集布板时对额定功率进行降额；
- 最大工作电压：避免长期接近或超过 50 V 的连续施加，防止击穿或电阻漂移；
- 焊接工艺：采用推荐的回流曲线与适当的焊膏，避免过高峰值温度与长时间暴露；
- 机械应力：贴装及之后的机械应力（挤压、弯曲）可能导致电阻值变化或开路，焊盘设计与组装流程需避免应力集中。
七、包装与储存建议
建议在干燥环境下密封存放，避免长时间潮湿暴露。开盘后尽量在推荐时间内使用完毕，必要时使用干燥剂并按回流前进行干燥处理（baking）以保证焊接质量。
总结：0402WGF1302TCE 以其小体积、1% 精度与宽温工作范围适用于多种低功耗、高密度贴装场合。详细电气特性与工艺参数请参阅厂商数据手册以获得准确的设计与可靠性指导。
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