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UNI-ROYAL 0201WMF4700TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF4700TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF4700TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 470Ω
- Electronic Component
- 10
- Electronic Component
- BM0257242290
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF4700TEE 产品概述
一、产品简介
0201WMF4700TEE 为 UNI-ROYAL（厚声）出品的贴片厚膜电阻，阻值 470Ω，精度 ±1%，额定功率 50mW，适用于超高密度 SMT 电路板。封装为 0201（极小封装），温度系数 ±200ppm/℃，允许工作电压 25V，工作温度范围 -55℃ 至 +155℃。该型号以微小体积、高精度和良好的温稳定性为特点，适配对体积和精度有严格要求的便携式及消费电子产品。
二、主要特性
- 厚膜工艺，抗焊接热冲击性良好；制造成本相对低，性能一致性好。
- 阻值：470Ω，公差 ±1%，适合对阻值稳定性有一定要求的精密电路。
- 额定功率 50mW，工作电压上限 25V，适合低功率信号与偏置电路使用。
- 温度系数 ±200ppm/℃，在宽温区间内保持较好阻值漂移控制。
- 工作温度范围宽（-55℃~+155℃），适应工业级环境。
- 极小 0201 封装，利于高密度布板与小型化产品设计。
三、典型应用场景
- 手机、可穿戴设备、蓝牙耳机等便携消费电子的阻性网络与偏置电阻。
- IoT 终端、传感器前端的滤波、分压与拉/下拉电阻。
- 高密度 PCB 的去耦、信号匹配与微小阻值阵列设计（空间受限场合）。
- 精密模拟电路中对体积与温漂有要求的非高功率场合。
四、封装与焊接建议
- 0201 小体积封装对贴装精度与回流温度曲线敏感，建议使用高精度贴片机与针对 0201 的回流曲线。
- 推荐按照 PCB 设计规则优化焊盘尺寸与阻焊开窗，降低焊膏过量或不足导致的偏移问题。
- 建议遵循制造商推荐的回流温度曲线，避免过高峰值温度或过长高温暴露，以免影响可靠性。
五、可靠性与存储
- 产品通过常见的可靠性试验项目（如焊接性、热冲击、湿热、负载寿命等），在规范使用条件下表现稳定。
- 存储建议：密封干燥、避免潮湿与强光直射，回流前如发现受潮应按照焊接制程要求进行烘烤处理。
- 包装一般采用卷带（Tape & Reel），适合自动化贴装与批量生产。
六、选型与注意事项
- 该型号功率仅 50mW，不适合高功率分流或大电流应用，选用时应核算实际功耗与散热条件。
- 0201 尺寸在维修与手工焊接时难度较高，需考虑产线与维修可行性。
- 在高频或精密阻抗匹配场合，应关注寄生电感与电容对电路性能的影响。
0201WMF4700TEE 以其微小封装与高精度特性，特别适合追求小型化与高密度布板的电子产品，是便携设备与精密低功耗电路的优选贴片电阻方案。若需更详细的电气参数曲线、回流曲线或可靠性试验报告，可联系供应商获取完整数据手册。
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