WMSIC Electronic Components

UNI-ROYAL 0402WGF6191TCE

Model0402WGF6191TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF6191TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF6191TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
6.19kΩ
Electronic Component
10
Electronic Component
BM0257342045
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF6191TCE — UNI-ROYAL(厚声) 0402 6.19kΩ ±1% 厚膜贴片电阻 产品概述

一、概述

0402WGF6191TCE 是 UNI-ROYAL(厚声)出品的一款厚膜贴片电阻,封装为 0402(约 1.0 mm × 0.5 mm),标称阻值 6.19 kΩ,阻值精度 ±1%,额定功率 62.5 mW,额定工作电压 50 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ ~ +155℃。该器件以体积小、成本低、适用于高密度贴装为特点,适合低功耗信号与偏置电路应用。

二、主要特性

  • 厚膜工艺:工艺成熟、良率高、成本优势明显。
  • 小尺寸封装:0402 适合高密度 SMT 布局,节省 PCB 面积。
  • 精度与温漂:±1% 精度配合 ±100 ppm/℃ 的温度系数,适合一般精度要求的电阻网络。
  • 宽温工作:-55℃ 到 +155℃,适用于消费电子、工业级温度环境。

三、关键参数及使用限制

  • 标称阻值:6.19 kΩ;精度 ±1%。
  • 额定功率:62.5 mW(在规定的环境与散热条件下)。建议实际设计中考虑功率降额以提高可靠性(通常取额定功率的 50% 左右)。
  • 额定电压:50 V(器件的最大工作电压),但需同时满足功率限制:由功率得出的最大安全电压 Vmax = sqrt(P·R) ≈ sqrt(0.0625·6190) ≈ 19.7 V。因此在实际电路中,施加电压应同时小于 19.7 V 与器件额定电压 50 V,以免超功耗。
  • 最大电流 Imax = sqrt(P/R) ≈ 3.18 mA。
  • TCR 对精度影响:±100 ppm/℃ 意味着温度变化 100℃ 时阻值变化约 ±1%,与 ±1% 初始公差同量级,温度敏感场合需考虑温漂叠加影响。

四、典型应用场景

  • MCU/传感器的上拉/下拉电阻、偏置网络。
  • 滤波、限流、分压器及信号调理电路的低功率设计。
  • 移动设备、可穿戴、物联网终端、消费电子及部分工业控制场合。
  • 不建议用于高精度测量或需要极低温漂的精密参考电路(应选用薄膜或金属箔电阻)。

五、焊接、储存与可靠性建议

  • 推荐采用标准回流焊工艺,遵循元件供应商给出的温度曲线。
  • 为保证长期稳定性,电阻实际工作功率建议进行降额设计,环境温度高、PCB 散热差时需进一步降低允许功率。
  • 0402 尺寸小,焊接时注意夹具与贴片机参数,避免过热或偏位。
  • 储存应避光、干燥、常温,防止受潮影响焊接性。

六、封装尺寸提示

0402(英制)对应常用尺寸约 1.0 mm × 0.5 mm,适合高密度贴片工艺。焊盘及锡膏设计建议参考制造商推荐的 PCB land pattern,以确保焊点可靠性与机械强度。

七、选型与采购建议

在选型时,关注电路中实际最高电压与电流,优先按功率导出电压限制(约 19.7 V)判断是否满足需求;若电路有较大温度变化或要求更低温漂,应考虑更小 TCR 或更高精度的产品。采购时确认包装卷带、批次及是否有质量认证(如 RoHS)等,以满足生产与可靠性要求。

以上为 0402WGF6191TCE 的产品概述及常用设计注意事项,可作为设计选型与电路验证的参考。若需进一步的规范数据表(如阻值漂移曲线、功率-温度降额曲线、回流曲线和机械冲击数据),建议向供应商索取完整规格书。

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