Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0201WMF150KTEE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF150KTEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF150KTEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 1.5Ω
- Electronic Component
- 1
- Electronic Component
- BM0231091944
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- 100ppm/℃~+350ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF150KTEE 产品概述
一、产品简介
0201WMF150KTEE 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，型号对应阻值 1.5Ω、精度 ±1%、额定功率 50mW。该器件采用 0201 超小封装，适合高密度贴片电路，工作电压最高 25V，工作温度范围宽（-55℃～+155℃），适用于体积受限、对空间和重量敏感的移动及便携类电子设备。
二、主要特性
- 阻值：1.5Ω，精度 ±1%（高精度厚膜工艺）。
- 额定功率：50mW，适合低功耗电路。
- 工作电压：最大 25V。
- 温度系数（TCR）：-100ppm/℃ ～ +350ppm/℃，在温度变化下阻值漂移可控但范围较宽。
- 工作温度：-55℃ ～ +155℃，满足一般工业环境要求。
- 封装：0201（典型尺寸约 0.6mm × 0.3mm），便于超小型化设计与高密度布板。
三、典型应用场景
- 移动终端、可穿戴设备和微型传感器中的分压、阻尼或限流场合。
- 高频或高密度电路板上的通用阻值元件，用于信号匹配、偏置和旁路网络。
- 需要小尺寸、可靠贴装且工作在低功率条件下的消费电子产品。
四、选型与使用建议
- 若电路对温漂极为敏感（如精密采样或高精度电流检测），建议评估 TCR 范围对系统误差的影响，必要时考虑低 TCR 的金属膜或合金电阻。
- 额定功率 50mW 为常温值，工作在高温环境下需按可靠性规程进行降额使用。
- 遵循无铅回流焊工艺，建议峰值温度按工艺规范（约 250℃～260℃）控制并缩短高温滞留时间，以免影响可靠性。
- 0201 尺寸极小，贴装时注意 pick-and-place 精度、焊膏量控制与回流曲线优化，避免虚焊或桥连。
五、存储与装配注意
- 建议按照供应商包装与防潮等级保存，避免潮湿环境导致焊接缺陷。
- 取放时使用专用吸嘴或防静电工具，避免手工挤压或弯折元件本体。
- 清洗时选用对厚膜材料安全的溶剂并避免过度机械振动。
六、质量与验证
建议在批量使用前参照供应商提供的数据手册进行样件验证，包括阻值/精度、温漂、焊接可靠性及热循环试验，以确保在目标应用环境下满足长期稳定性要求。
总结：0201WMF150KTEE 以超小封装和较高精度为特色，适合对体积和焊盘空间有严格要求且处于低功耗工作点的电子产品。选型时关注 TCR 与功率降额规则，合理设计焊接流程与布局即可发挥其体积优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
