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UNI-ROYAL 0201WMJ0112TEE
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0112TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0112TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1.1kΩ
- Electronic Component
- 50
- Electronic Component
- BM0258833867
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0112TEE 产品概述
一、产品简介
0201WMJ0112TEE 是 UNI-ROYAL（厚声）系列的贴片厚膜电阻，阻值 1.1kΩ，公差 ±5%，额定功率 50mW，封装尺寸为 0201（最小型表面贴装）。该器件针对高密度、轻薄化电子产品设计，在保证基本电气性能的同时，占用空间极小，适合移动设备、物联网终端和高密度模块化电路。
二、主要电气参数
- 阻值：1.1kΩ ±5%
- 额定功率：50mW（室温条件下）
- 最高工作电压：25V
- 温度系数（TCR）：±200 ppm/℃（约 0.22Ω/℃）
- 工作温度范围：-55℃ ~ +155℃
说明：按照额定功率计算，器件在满功率时的最大持续电流约：
- Imax = sqrt(P/R) ≈ sqrt(0.05 / 1100) ≈ 6.7 mA
对应的压降约 V = I·R ≈ 7.4 V。请注意“最高工作电压”25V为器件耐压限制，但在实际应用中若电压超过约 7.4V 会导致超过额定功率，应按功率和温升进行降额设计。
三、热性能与降额建议
0201 尺寸限制了散热能力，实际可耗散功率受焊盘热反射、PCB 铜箔面积及环境温度影响明显。建议：
- 在高温环境或靠近发热元器件时进行降额（参考供应商降额曲线）；
- 设计时增加焊盘铜箔面积或热通孔以改善散热；
- 严禁长时间在接近 +155℃ 的环境中持续满载工作。
四、封装与装配注意事项
0201 尺寸极小，推荐使用自动贴装与回流焊工艺。装配与检修注意：
- 采用高精度贴装机和适合的吸嘴，避免偏移或滚动；
- 回流焊温度曲线应符合 PCB 与无铅工艺要求，避免过度焊接造成机械应力或电阻漂移；
- 手工焊接极其困难，建议避免。
五、可靠性与典型应用
该厚膜电阻适用于手机、智能手表、蓝牙/IoT 模块、可穿戴设备、微型传感器阵列和高密度电路板的分流/限流/上拉下拉等用途。典型可靠性测试包括温度循环、机械冲击、焊接热稳定性与阻值老化试验，满足一般消费电子产品的长期使用要求。
六、选型与订购提示
型号 0201WMJ0112TEE 明确了封装 0201、阻值 1.1kΩ 与公差 ±5%，选型时应确认：
- 实际工作电压与电流是否会导致功率超限并需降额；
- 系统对温漂的敏感性，±200 ppm/℃ 在温度变化较大场合会引起明显阻值偏移；
- 是否需要更高精度或更低 TCR 的替代型号。
如需样品、可靠性数据或降额曲线，建议联系 UNI-ROYAL 技术支持获取完整数据表与焊接指导。
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