WMSIC Electronic Components

UNI-ROYAL 0201WMF1005TEE

Model0201WMF1005TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF1005TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF1005TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
10MΩ
Electronic Component
10
Electronic Component
BM0257242287
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF1005TEE 产品概述

一、产品简介

0201WMF1005TEE 是 UNI-ROYAL(厚声)出品的 0201 封装厚膜贴片电阻,阻值 10MΩ,精度 ±1%,额定功率 50mW,额定工作电压 25V。工作温度范围为 -55℃ 至 +155℃,温度系数(TCR)为 ±200ppm/℃。该型号适用于对体积与高阻值有严格要求的微型化电路。

二、主要参数与电气特性

  • 阻值:10MΩ ±1%
  • 额定功率:50mW(在推荐散热条件下)
  • 额定工作电压:25V(电压为器件的实际限额,应优先遵守)
  • TCR:±200ppm/℃(举例:温差 100℃ 时约 2% 的阻值变化)
  • 工作温度:-55℃ ~ +155℃
    0201 超小封装对绝缘与泄漏电流敏感,实际应用中需关注表面污染与湿度影响。

三、优势与适用场景

体积极小、适合高密度 PCB;高阻值与较高精度使其适合偏置电阻、采样电路、高阻放大输入网络、仪表前端及便携设备。厚膜工艺在成本与可获得性上优于薄膜高阻选择,适合批量应用。

四、设计与使用注意事项

  • 电压与功率:尽管理论上功率允许更大电压(P=V²/R),但器件标称工作电压为 25V,应以此为准避免表面击穿或泄漏。
  • 温漂影响:TCR ±200ppm/℃ 在高精度测量需考虑漂移补偿或选择温度稳定方案。
  • 漏电与噪声:10MΩ 属高阻,电路对微安乃至皮安级漏电敏感,布线应采用防泄漏工艺(加大爬电距离、使用 guard trace、严格清洁 PCB 残渣)。
  • 机械应力:0201 极易受剪切与弯曲损伤,布局时避免在过孔附近或边缘位置受力。

五、焊接与可靠性建议

建议遵循制造商回流焊工艺曲线进行焊接,严格控制峰值温度与保温时间;焊后进行目视或 X-ray 检查以确保贴装完整。长期可靠性受湿度、污染与温度循环影响,建议进行适当的封装或涂覆保护。

六、采购与选型提示

在选型时核对阻值、精度、工作电压与温漂要求;批量采购时与 UNI-ROYAL 确认供货包装、出货卷带规格及湿敏等级(MSL)。若电路对温漂或噪声有更高要求,可考虑薄膜或有特殊工艺的高阻电阻作为替代。

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