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UNI-ROYAL 0201WMF1052TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF1052TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF1052TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 10.5kΩ
- Electronic Component
- 50
- Electronic Component
- BM0265088709
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF1052TEE 产品概述
一、主要参数
产品型号：0201WMF1052TEE（品牌：UNI-ROYAL / 厚声）
电阻类型：厚膜贴片电阻（0201 封装，公制约 0.6 mm × 0.3 mm）
阻值：10.5 kΩ（标称）
精度：±1%（F）
额定功率：50 mW
最大工作电压：25 V
温度系数（TCR）：±200 ppm/℃
工作温度范围：-55 ℃ ~ +155 ℃
二、产品特点
- 小型化封装：0201 超小体积，适用于高密度布板与微型终端设备，节省 PCB 面积。
- 精密阻值：±1% 高精度等级，适合对阻值稳定性有要求的模拟与数字电路。
- 稳定性良好：厚膜工艺兼顾成本与可靠性，常温下具有良好的长期稳定性与抗冲击能力。
- 宽温区工作：-55 ℃ 至 +155 ℃ 的工作温度范围，能适应较为恶劣的环境条件。
- 低功耗应用：50 mW 的功率规格适合便携式、低功耗电路使用。
三、典型应用场景
- 移动通信与可穿戴设备：用于限流、分压、偏置网络等场合，满足小体积及轻载功率需求。
- IoT 与传感器节点：在低功耗测量电路中作精密分压或阻抗匹配元件。
- 消费电子：主板、蓝牙模块、摄像头模组中的微型电阻网络。
- 精密模拟前端：在阻容滤波、增益设定等对阻值精度有要求的应用中使用。
四、封装与工艺建议
- 焊接工艺：适用于无铅回流焊工艺。建议遵循制造商提供的回流焊曲线，峰值温度与加热速率应符合元件耐受范围以保证可靠性。
- 焊盘设计：由于 0201 封装尺寸极小，建议参考厂方推荐的焊盘尺寸与丝网印刷量，避免多余焊膏导致桥连或焊点不良。
- 降额使用：器件额定功率为 50 mW，建议在高环境温度或长时间功耗情况下进行适当降额，以延长使用寿命并提高可靠性。
五、使用与储存注意事项
- 禁止超额电压：工作电压应不超过 25 V，以防击穿或电阻值漂移。
- 环境与清洗：高温高湿环境会影响长期可靠性，清洗时避免使用强酸强碱化学试剂；若需清洗，选择与元件兼容的清洗工艺。
- 存储条件：建议干燥、常温、避免直射阳光和化学品污染的环境中保存，按包装指示使用防潮措施。
- 质量验证：在关键应用中建议进行首件焊接验证与在线阻值抽检，以确认制造与封装工艺对实际电路的影响。
0201WMF1052TEE 以其微小封装与高精度特性，适合对体积与精度有双重需求的现代电子产品。在设计时关注焊接工艺与热管理，可获得稳定可靠的实装表现。若需详细尺寸图、回流曲线或可靠性试验数据，建议联系供应商或查阅产品规格书。
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