WMSIC Electronic Components

UNI-ROYAL 0201WMF3000TEE

Model0201WMF3000TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF3000TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF3000TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
300Ω
Electronic Component
10
Electronic Component
BM0263574861
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF3000TEE 厚膜贴片电阻产品概述

一、核心参数与性能指标

0201WMF3000TEE是一款专为小型化电子设备设计的厚膜贴片电阻,核心参数与性能明确适配低功耗、高精度场景:

  • 阻值与精度:标准阻值300Ω,精度±1%,可满足多数信号调理、分压电路的精准度需求,无需额外校准即可实现稳定输出;
  • 功率与电压:额定功率50mW,最大工作电压25V,适配低功耗电路(如可穿戴设备、小型传感器模块),避免功率过载风险;
  • 温度特性:温度系数(TCR)±200ppm/℃,工作温度范围-55℃至+155℃,宽温环境下阻值漂移可控,适用于工业、汽车等温度波动较大的场景;
  • 封装尺寸:0201英制封装(对应公制0.6mm×0.3mm),超小体积适配高密度PCB布局,为设备“轻、薄、小”设计提供空间支持。

二、品牌与封装优势

该产品由国内资深被动元器件厂商UNI-ROYAL(厚声)出品,厚膜工艺与0201封装的组合兼具性能与成本优势:

  • 厚膜工艺特性:相较于薄膜电阻,成本更具竞争力;相较于碳膜电阻,精度更高、稳定性更强,批次一致性可达行业领先水平,适合中高端消费电子及工业应用;
  • 0201封装适配性:超小体积可在同一PCB上集成更多功能模块,常见于智能手机、智能手环等空间受限设备;同时支持回流焊、波峰焊等常规贴片工艺,生产兼容性好,无需特殊设备即可批量加工。

三、典型应用场景

结合参数与封装特性,0201WMF3000TEE适用于以下核心场景:

  1. 消费电子领域:智能手机的传感器信号调理电路(如加速度计、陀螺仪的偏置调节)、蓝牙耳机的音频滤波电路,精准度满足信号传输稳定性需求;
  2. 汽车电子辅助电路:车载小型控制器(如胎压监测模块、氛围灯控制单元)的低功耗信号链路,宽温特性适配汽车舱内-40℃至+85℃的温度变化;
  3. 可穿戴设备:智能手表、健康手环的心率传感器信号放大电路,50mW功率匹配设备低功耗设计,避免电池续航损耗;
  4. 小型医疗仪器:便携式血糖仪、电子体温计的模拟信号处理电路,±1%精度确保测量结果稳定,宽温范围适配不同使用环境。

四、使用注意事项

为保障产品长期可靠性,需注意以下要点:

  • 功率降额:实际工作功率建议不超过额定功率的70%(即35mW以内),避免长期满功率工作导致阻值漂移;
  • 电压限制:电路中施加电压不超过25V,防止绝缘层击穿;
  • 焊接工艺:回流焊峰值温度≤260℃,焊接时间≤10秒;波峰焊温度≤245℃,时间≤5秒,避免高温损坏电阻膜层;
  • 储存环境:未焊接产品需存放在温度-40℃至+30℃、相对湿度≤60%的环境中,避免受潮影响焊接性能。

0201WMF3000TEE凭借精准度、宽温特性与超小体积,成为小型化电子设备中信号调理、分压、限流等电路的优选厚膜贴片电阻,可有效平衡性能与成本需求。

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