WMSIC Electronic Components

UNI-ROYAL 0201WMF7501TEE

Model0201WMF7501TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF7501TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF7501TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
7.5kΩ
Electronic Component
10
Electronic Component
BM0257624888
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF7501TEE 产品概述

一、产品简介

0201WMF7501TEE 是 UNI-ROYAL(厚声)推出的一款高密度贴片厚膜电阻,阻值为 7.5 kΩ,精度 ±1%,额定功率 50 mW,额定工作电压 25 V。封装为 0201(典型尺寸约 0.6 mm × 0.3 mm),适合超小型化和高密度布板的消费电子及工业类终端产品。

二、主要电气参数

  • 阻值:7.5 kΩ(标称)
  • 精度:±1%
  • 额定功率:50 mW(常温)
  • 最大工作电压:25 V
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃

三、结构与封装特点

采用厚膜工艺,材料与膜层经过优化以保证在小封装下的可靠性与一致性。0201 极小体积便于高密度贴装,但对贴装精度、焊接工艺和分板要求较高。产品通常以卷盘(reel)方式供货,便于 SMT 贴装生产线自动化使用。

四、典型应用场景

  • 手机、可穿戴设备、蓝牙耳机等便携式电子产品的阻抗匹配、分压、偏置网络
  • IoT、传感器前端电路中的标准偏置与限流用途
  • 高密度 PCB 设计中用于节省空间的通用电阻器件

五、可靠性与环境适应性

工作温度范围宽(-55 ℃ 至 +155 ℃),适应严苛温度环境。厚膜电阻在湿热、温度循环和焊接热冲击方面经过行业常规检验,长期寿命稳定。为延长使用寿命,建议根据系统工作温度对功率进行降额管理(通常在高于 +70 ℃ 时开始线性降额,至最高温度时需按厂方曲线处理)。

六、PCB 设计与焊接建议

  • 建议使用兼容无铅工艺的回流焊(SnAgCu),回流峰值温度遵循工厂/焊膏规范(一般峰值 ≤ 260 ℃)。
  • 0201 封装对焊膏印刷和贴装精度要求高,推荐细小锡膏模板开孔并控制锡膏量。
  • 贴装时注意点胶/贴装压力与贴装头匹配,避免偏位或贴歪。
  • 为避免热应力和长期漂移,焊接后建议进行常温恢复和电阻值复测。

七、采购与包装

UNI-ROYAL(厚声)提供标准卷盘包装,亦可按需提供托盘或切带包装以适配不同生产流程。订购时请确认料号 0201WMF7501TEE、阻值及包装规格。

八、使用注意事项

  • 0201 体积极小,搬运与贴装需使用精密设备;人工焊接和手工操作风险高。
  • 在高湿、高盐雾环境下应注意防腐处理及绝缘保护。
  • 对于高精度或低噪声应用,厚膜电阻相对于金属膜电阻在噪声和长期漂移方面的表现需评估后选型。
  • 焊接后建议在常温条件下进行电阻值及功能性检测,确保装配质量。

若需详细的回流焊曲线、封装尺寸图或可靠性测试报告,可提供厂方数据手册以供设计验证与量产参考。

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