Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF6041TEE 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,阻值为 6.04 kΩ,公差 ±1%,额定功率 50 mW,额定工作电压 25 V,温度系数(TCR)±200 ppm/℃,工作温度范围 -55℃~+155℃。封装为超小型 0201,适用于对空间和重量有严格要求的高密度电路板设计。
厚膜工艺通过在陶瓷基片上印刷电阻浆料制成,具有良好的批量一致性和成本优势。该器件在体积极小的同时仍保持 50 mW 的额定功率,适合要求高密度布局的便携或可穿戴设备。厚膜电阻噪声略高于金属膜,对高精度低噪前端电路需慎重评估。
适用于智能手机、可穿戴设备、蓝牙/IoT 终端、精密分压/偏置网络、滤波器与限流等空间受限的消费电子与工控场合。1% 精度配合 6.04 kΩ 阻值,适合通用模拟与数字混合应用。
该系列器件适应宽温区且耐环境变化,常见可靠性测试包括温度循环、湿热、焊接热稳定性与机械振动。存储建议防潮、防尘,长期储存应遵循厂方包装与保管说明。
0201WMF6041TEE 适合对体积要求极高且容许厚膜 TCR 的场合。若需更低噪声或更好温度稳定性,可考虑金属膜或薄膜 0201/0402 产品;若对功率或电压有更高要求,可选较大封装(0402、0603)或专用低阻/高功率系列。
下单时请以完整料号 0201WMF6041TEE 为准,向供应商确认当前包装形式(常见为 tape & reel)与焊接及可靠性数据表。对于特殊批次或应用环境,建议索取并参考厂方完整规格书与可靠性报告。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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