WMSIC Electronic Components

UniOhm 0201WMF6803TEE Resistor 0201WMF6803TEE

Model0201WMF6803TEE
Package0201
BrandUNIOHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Uni Ohm 0201WMF6803TEE
Type
UNIOHM
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNIOHM
Electronic Component
0201WMF6803TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
680kΩ
Electronic Component
10
Electronic Component
BM0263512635
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF6803TEE — UniOhm(台湾厚声)0201 厚膜电阻产品概述

一 产品简介

0201WMF6803TEE 是 UniOhm(台湾厚声)推出的一款微型厚膜贴片电阻,阻值为 680kΩ,精度 ±1%,封装规格为 0201。该器件体积小、重量轻,适配高速贴片机,能够降低组装和物流成本,适用于需要高密度布局和轻量化设计的电子产品。

二 主要特性

  • 阻值:680kΩ(±1%)
  • 功率额定:50mW(在规定环境温度下)
  • 最大工作电压:25V
  • 温度系数(TCR):±200 ppm/℃,温度漂移小,适合一般精密要求场合
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0201(适配常见贴片机与回流/波峰焊工艺)
  • 制程:厚膜(Thick Film),具有成本优势与良好的一致性

三 焊接与装配建议

  • 兼容波峰焊与无铅回流焊工艺。建议在符合无铅回流规范的条件下,峰值温度≤260℃并严格控制停留时间,以保证可靠性。
  • 由于 0201 尺寸极小,建议采用高精度贴片与回流参数优化,确保焊点一致性与良率。
  • 贴片时注意真空吸嘴尺寸与定位精度,避免器件错位或吸嘴残留。

四 可靠性与环境适应性

  • 工作温度范围宽(-55℃ ~ +155℃),能满足汽车电子、工业控制等对温度耐受性的要求(具体应用请参照实际验证)。
  • 按照行业标准进行环境应力测试(湿热、温度循环、机械振动等)可获得稳定的电阻值和寿命表现。
  • 在高温或高功耗场景下应考虑热降额和布局散热,避免长期超额使用导致漂移或失效。

五 典型应用场景

  • 移动终端、可穿戴设备、蓝牙/IoT 节点等对体积和重量敏感的消费电子
  • 高密度 PCB 布局中的分压、偏置与阻抗匹配网络
  • 工业与汽车电子中要求小尺寸与宽温区的传感器与控制模块
  • 精密测量与滤波电路中对阻值稳定性有要求的场合

六 包装与订购信息

  • 品牌:UniOhm(台湾厚声)
  • 型号:0201WMF6803TEE
  • 封装:卷带 (Tape & Reel),便于贴片机自动化装配
  • 订购时请确认阻值、精度、包装数量与出库批次需求,批量应用建议要求样品验证与可靠性报告。

七 使用注意事项

  • 本型号功率额定较低(50mW),设计时需核算电阻两端实际功耗并留有安全裕度。
  • 在高湿、高盐雾等腐蚀性环境中,应结合防护涂层或封装工艺提升可靠性。
  • 对于对温漂非常敏感的应用,建议在电路设计中评估 ±200 ppm/℃ 的影响并考虑温度补偿。

产品以小型化与工艺兼容性为优势,适合大规模自动化装配的现代电子产品。若需更详细的电气特性曲线、降额曲线或可靠性测试报告,可联系 UniOhm(台湾厚声)提供完整数据手册与样品支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.