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XNRUSEMI XR4009S
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR4009S
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR4009S
- Electronic Component
- 1
- Package
- SOP8
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.173g
- Electronic Component
- 1
- Electronic Component
- BM0264844067
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 2W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 40V
- Capacitor(Ciss)
- 964pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR4009S 产品概述
一、产品简介
XR4009S 是 XNRUSEMI（新锐）推出的一款高单元密度沟槽式 N 沟道 MOSFET，封装为 SOP8。该器件针对同步降压转换器与中低压功率开关场景优化，兼顾极低导通电阻与适中栅极电荷，适合在空间受限但需高效率的电源前端与功率管理电路中使用。符合 RoHS 与绿色产品要求，并声明“100%保证 EAS”，具备完整功能可靠性认证。
二、主要参数
- 漏源电压 Vdss：40 V
- 连续漏极电流 Id：9 A
- 导通电阻 RDS(on)：12 mΩ @ Vgs=10 V
- 功耗 Pd：2 W（封装热限制相关，请参考具体散热条件）
- 阈值电压 Vgs(th)：1.5 V
- 总栅极电荷 Qg：22.9 nC @ Vgs=20 V
- 输入电容 Ciss：964 pF
- 反向传输电容 Crss：96 pF
- 工作温度范围：-55 ℃ ~ +150 ℃
- 封装：SOP8
- 单位：1 个 N 沟道 MOSFET
三、关键特性与优势
- 低 RDS(on)：12 mΩ 在 10 V 驱动下提供极低传导损耗，利于提高转换效率。
- 适中栅极电荷：Qg=22.9 nC（20 V）在高频开关场合兼顾开关损耗与驱动功耗，便于驱动器选择与系统匹配。
- 沟槽式工艺：高单元密度实现更低导通电阻和更稳定的热性能。
- 全面可靠性与合规性：RoHS、绿色产品认证与完整功能可靠性认证，适合商业及工业级应用部署。
四、典型应用场景
- 同步降压（Synchronous Buck）转换器的高侧或低侧开关。
- DC-DC 电源模块、笔电与嵌入式电源管理。
- 负载开关、功率分配与电机驱动（中小功率）。
- 通信基站、电源适配器与开关电源（SMPS）前端。
五、设计与使用建议
- 驱动电压：为达到标称 RDS(on)，建议栅极驱动 Vgs=10 V；若采用逻辑电平驱动（如 5 V），需验证导通电阻与损耗是否满足系统要求。
- 开关损耗管理：Ciss 与 Qg 将影响开关瞬态损耗，选择合适栅极驱动器/缓冲以缩短切换时间并控制 EMI。Crss（96 pF）会带来米勒效应，设计布局时注意回路寄生与栅极抗震。
- 热管理：SOP8 封装 Pd=2 W（典型封装条件），在实际电路中应通过大面积铜箔、散热过孔或散热器降温，避免长期超额流过导致热失效。
- 安全余量：工作电压不超过 40 V，考虑浪涌与瞬态时给出适当裕度及保护方案（TVS、RC 吸收等）。
XR4009S 以其低导通电阻与良好开关特性，为要求高效率与小体积的电源方案提供可靠的 MOSFET 选项。具体应用前建议参考完整器件数据手册与热阻/脉冲额定值，按实际 PCB 布局与散热条件进行仿真与验证。
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