WMSIC Electronic Components

XNRUSEMI XR100N03Z

ModelXR100N03Z
PackageTO251-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR100N03Z
Type
XNRUSEMI
Minimum package
80 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR100N03Z
Electronic Component
1
Package
TO251-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0264844062
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
80W
Electronic Component
Electronic Component
Electronic Component
80
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR100N03Z 产品概述

一、概述

XR100N03Z 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道 MOSFET,专为同步降压转换器和高效率电源管理应用优化。器件在保证低导通电阻的同时兼顾较低的栅极电荷,从而在高电流开关场合实现更低的导通和开关损耗。

二、主要电气参数

  • 类型:N 沟道 MOSFET
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:100 A(在适当散热条件下)
  • 导通电阻 RDS(on):10 mΩ @ VGS = 4.5 V
  • 耗散功率 Pd:80 W
  • 阈值电压 VGS(th):2.5 V
  • 总栅极电荷 Qg:45 nC @ VGS = 10 V
  • 输入电容 Ciss:2.1 nF
  • 反向传输电容 Crss(Miller):282 pF
  • 工作温度范围:-55 ℃ ~ +175 ℃
  • 封装:TO251-3L

三、性能特点与典型应用

  • 低 RDS(on)(10 mΩ@4.5V)使器件在高电流路径上具有较小的导通损耗,适合 12V/5V/3.3V 降压转换器、服务器电源及电池供电系统。
  • 中等 Qg(45 nC@10V)兼顾了驱动能耗与开关速度,适配常见驱动器与控制器;Crss = 282 pF 需在高速切换时注意 Miller 问题以防止死区损耗增加。
  • 宽工作温度范畴与 80W 耗散能力利于苛刻环境下的可靠运行与热裕量管理。

四、封装与热管理建议

TO251-3L 封装提供良好的散热通道与焊接可靠性。实际电路设计中建议:优化铜箔散热层、使用多层 PCB 热通道、在必要时配合散热片或强制风冷,以确保在高电流工作下 MOSFET 的结温与封装功耗保持在安全范围内。

五、合规与可靠性

产品符合 RoHS 与绿色环保要求,100% 保证 EAS,具备完整功能与可靠性认证,适合量产导入与工业级应用场景。

总结:XR100N03Z 以 30V、100A 与 10 mΩ 的特性,提供了在中低压、大电流开关电源及功率转换场合的高性价比选择,设计时需结合开关频率与驱动方案优化栅极驱动与热设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.