Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XNRUSEMI XR12N03M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR12N03M
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR12N03M
- Electronic Component
- 1
- Package
- DFN2020-6L
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264844086
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 3W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR12N03M 产品概述
一、主要参数与特点
XR12N03M 是一款高单元密度沟槽式 N 沟道 MOSFET，面向小功率开关与负载开关应用。主要电气参数如下：
- 数量：1 个 N 沟道
- 漏源电压 Vdss：30 V
- 连续漏极电流 Id：12 A
- 导通电阻 RDS(on)：13 mΩ @ Vgs=10 V
- 功耗 Pd：3 W
- 阈值电压 Vgs(th)：2.5 V
- 栅极电荷 Qg：16 nC @ 10 V
- 输入电容 Ciss：614 pF，反向传输电容 Crss：98 pF
- 工作温度：-55 ℃ ~ +150 ℃
- 封装：DFN2020-6L 此外产品符合 RoHS 与绿色环保要求，具备完整的功能可靠性。
二、优势与典型应用
该器件以低导通电阻与紧凑封装为特点，适用于：
- DC-DC 转换器低侧开关与同步整流
- 电源负载开关、直流电机驱动的小功率通道
- 电池管理与移动设备电源路径控制
- 通用开关场合需要兼顾效率与体积的应用
三、驱动与开关性能建议
- 为获得标称 RDS(on)，推荐栅极驱动电压为 10 V；Vgs(th)=2.5 V 表明该器件非严格逻辑电平型，在 5 V 驱动下导通电阻会显著上升。
- 栅极电荷 Qg=16 nC 与 Ciss/Crss 表明在高频开关时需要注意驱动器的瞬态能力与驱动损耗，合理选型驱动芯片并采取软切换或限流斜率控制可降低损耗与电磁干扰。
- 开关损耗与结电容相关，布局上尽量缩短信号环路，优化散热有助于降低结温并提高开关可靠性。
四、热管理与封装注意事项
- 封装为 DFN2020-6L，体积小利于高密度布局，但散热能力受限；标称 Pd=3 W 为封装和使用条件下的参考值，实际连续电流能力依赖 PCB 散热、铜厚与过孔布局。
- 推荐在 PCB 上设计大地铜铺或散热焊盘，并使用多层过孔连接至内层/底层散热层，以降低结温并提升持续负载能力。
- 注意工作环境温度与热阻，在高温环境下需留足裕量确保器件在安全结温范围内工作。
五、选型与可靠性建议
- 若系统驱动仅为 5 V 或更低，应确认在该驱动电压下的导通损耗是否满足效率与发热需求，必要时选择逻辑电平型 MOSFET。
- 考虑开关频率、占空比与瞬态应力（浪涌电流、dv/dt），并配合适当的保护电路（肖特基或 TVS、RC 吸收等）。
- XR12N03M 适合追求小体积与较低导通损耗的设计场景，结合合适的 PCB 散热处理与驱动策略，可在多种低功耗开关应用中获得良好表现。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
