WMSIC Electronic Components

XNRUSEMI XR3404A

ModelXR3404A
PackageSOT23
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR3404A
Type
XNRUSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR3404A
Electronic Component
1
Package
SOT23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264844081
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1.5W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR3404A N沟道MOSFET产品概述

XR3404A是新锐半导体(XNRUSEMI)推出的一款小封装、低电压、中电流N沟道MOSFET,专为空间受限、效率优先的电子系统设计,兼顾高功率密度与可靠性,可满足便携设备、电源管理、负载开关等多场景需求。

一、产品定位与核心价值

XR3404A聚焦**≤30V低电压、≤6A中电流**应用场景,核心价值体现在:

  1. 紧凑封装适配小型化:采用SOT-23封装,尺寸仅约1.6×2.9mm,可直接集成于便携电子、穿戴设备等空间紧张的PCB中;
  2. 低导通损耗提升效率:40mΩ导通电阻在4.5V栅压下即可实现,匹配主流MCU(3.3V/5V输出)驱动能力,减少电源转换损耗;
  3. 宽温范围覆盖极端场景:工作温度支持-55℃至+150℃,满足工业级应用对环境适应性的要求。

二、关键参数与性能亮点

XR3404A的核心参数围绕“效率、驱动兼容性、开关速度”优化,具体亮点如下:

(1)功率与导通特性

  • 漏源电压(Vdss)30V:覆盖常见低电压电源场景(如5V/12V系统),耐压余量充足,避免过压损坏;
  • 连续漏极电流(Id)6A:支持中功率负载驱动(如小型电机、LED阵列),峰值电流能力可满足瞬间负载需求;
  • 导通电阻(RDS(on))40mΩ@4.5V:在低栅压下实现低导通损耗,相比同类SOT-23封装器件,效率提升约10%(参考同类产品对比);
  • 耗散功率(Pd)1.5W:SOT-23封装下的功率密度优异,通过PCB散热设计可稳定支撑连续工作。

(2)驱动与开关特性

  • 阈值电压(Vgs(th))2.5V@250uA:匹配3.3V/5V MCU驱动,无需额外栅极升压电路,简化系统设计;
  • 栅极电荷量(Qg)5.2nC@10V:低Qg值意味着开关损耗小,适合高频应用(如DC-DC转换器开关频率可达几百kHz);
  • 电容匹配性:输入电容(Ciss)490pF、反向传输电容(Crss)61pF、输出电容(Coss)79pF,电容特性稳定,可减少开关噪声与振铃。

三、封装与物理特性

XR3404A采用SOT-23封装(3引脚),符合JEDEC标准,物理特性如下:

  • 尺寸:长2.9±0.1mm、宽1.6±0.1mm、高1.1±0.1mm;
  • 引脚间距:0.95±0.05mm,兼容标准贴片焊接工艺;
  • 封装材料:耐高温塑料,适配回流焊(峰值温度260℃,时间≤30s)。

四、典型应用场景

XR3404A的参数特性使其适配多类电子系统,典型应用包括:

  1. 便携设备电源管理:手机、平板、TWS耳机的充电保护电路、升压/降压DC-DC转换器;
  2. 小型负载开关:LED背光驱动、按键开关控制、USB接口电源通断;
  3. 电池保护电路:锂聚合物电池的过充/过放保护(30V耐压满足单节/多节电池需求);
  4. 工业控制小信号开关:传感器信号通断、小型继电器驱动(宽温范围适配工业环境);
  5. 物联网终端:低功耗节点的电源切换、无线模块的供电控制。

五、可靠性与环境适应性

XR3404A通过多项可靠性测试,满足工业级应用要求:

  • 温度循环:-55℃~+150℃循环测试(1000次),性能无衰减;
  • 湿度测试:85℃/85%RH环境下存储1000h,参数稳定;
  • ESD防护:符合人体模式(HBM)Class 2(±2kV)、机器模式(MM)Class 3(±200V)标准,降低静电损坏风险。

XR3404A以“小封装、高效率、宽温稳定”为核心优势,为低电压中电流应用提供了高性价比的MOSFET解决方案,可快速集成于各类小型化电子系统中。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.