WMSIC Electronic Components

XNRUSEMI 2N7002K

Model2N7002K
PackageSOT-23
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI 2N7002K
Type
XNRUSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
2N7002K
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.037g
Electronic Component
1
Electronic Component
BM0264974420
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
350mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2N7002K 产品概述

一、概览

2N7002K(品牌:XNRUSEMI/新锐)是一款沟槽式高单元密度的N沟道小功率MOSFET,采用SOT-23封装,面向多数小信号开关与负载开关场景。器件符合RoHS与绿色产品要求,并通过全面可靠性认证,ESD等级为2000V HBM,适合用于空间受限、成本敏感的便携与消费类电子产品。

二、主要参数要点

  • 类型:N沟道MOSFET
  • 漏源电压 Vdss:60V
  • 连续漏极电流 Id:300mA
  • 导通电阻 RDS(on):2.87Ω @ Vgs=4.5V
  • 阈值电压 Vgs(th):2.5V(典型/门限电压)
  • 功耗 Pd:350mW
  • 栅极总电荷 Qg:1.7nC @ Vgs=4.5V
  • 输入电容 Ciss:28pF;输出电容 Coss:11pF;反向传输电容 Crss:4pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOT-23
  • ESD:2000V HBM

三、特性与优势

  • 低电荷、低电容:Qg仅1.7nC,Ciss=28pF,便于快速开关,适合高频或脉冲开关场景,减小驱动能量消耗。
  • 逻辑级驱动(注意门限):RDS(on)在4.5V栅压下为2.87Ω,适合由5V逻辑直接驱动;若仅用3.3V驱动,导通电阻会显著上升,应验证实际导通损耗。
  • 高耐压:60V耐压适应更高电压的开关与保护用途。
  • 小封装节省PCB面积,适合高密度设计。
  • 通过可靠性认证并具备2000V HBM ESD保护,提高生产与使用过程中的一致性与稳定性。

四、典型应用场景

  • 低电流开关(传感器、继电器驱动前级)
  • 负载开关与电源管理(小功率模块上电,使能线)
  • 电平移位与接口缓冲(需注意在3.3V下的导通性能)
  • 信号开关、脉冲控件、微控制器驱动的指示灯/小马达控制(低电流)
  • 保护电路与反向电流控制

五、选型与电路建议

  • 驱动电压:若要求低RDS(on),建议采用≥4.5V栅压;在3.3V逻辑环境下,请在实际工况下测量导通电阻与压降,或考虑并联多枚器件以降低等效电阻(并联时需注意热均衡)。
  • 功耗估算:在最大连续电流300mA与RDS(on)=2.87Ω条件下,开态损耗约为 I^2·R = 0.3^2·2.87 ≈ 0.259W,低于标称Pd=0.35W,但封装散热与环境温度会影响允许电流,应留有裕量。
  • 开关布局:因器件电容小,易于快速切换;建议在门极加小电阻(10–100Ω)以抑制寄生振铃与限流;在高频应用中注意走线短、回流路径清晰。
  • ESD与装配:尽管器件具2000V HBM级别,仍建议在生产与维修中采取静电防护措施。

六、封装与采购

  • 标准封装:SOT-23,适合自动贴装与回流焊工艺。
  • 型号标识:2N7002K(XNRUSEMI/新锐)
  • 环保认证:RoHS 合规

总结:2N7002K是一款性能均衡、适合小功率开关与负载控制的N沟道MOSFET,优势在于小电荷、低电容与60V的高耐压。选型时注意栅极驱动电压与封装散热约束,能在多种便携与消费电子场景中提供可靠、成本友好的解决方案。

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