WMSIC Electronic Components

XNRUSEMI XR20N06

ModelXR20N06
PackageTO252-3L
BrandXNRUSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XNRUSEMI XR20N06
Type
XNRUSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XNRUSEMI
Electronic Component
XR20N06
Electronic Component
1
Package
TO252-3L
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0264974380
Operating Temperature
55℃~+175℃
Power Dissipation(Pd)
41.7W
Electronic Component
Electronic Component
Electronic Component
2500
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XR20N06 产品概述

一、概览

XR20N06 是 XNRUSEMI(新锐)推出的一款高单元密度沟槽式 N 沟道 MOSFET,额定漏源电压 60V,连续漏极电流 20A,封装为 TO252-3L。器件针对同步降压转换器等开关电源应用进行了优化,在导通电阻与栅极电荷之间实现良好平衡,适合中功率、高效率的转换场合。

二、主要电气参数

  • 漏源电压 (Vdss):60V
  • 连续漏极电流 (Id):20A
  • 导通电阻 (RDS(on)):32mΩ @ Vgs=10V
  • 耗散功率 (Pd):41.7W
  • 阈值电压 (Vgs(th)):2.5V
  • 总栅极电荷 (Qg):22nC @ Vgs=10V
  • 输入电容 (Ciss):1.355nF
  • 反向传输电容 (Crss):49pF
  • 工作结温度:-55℃ ~ +175℃

三、性能亮点

该器件采用沟槽结构和高单元密度设计,在同等体积下提供较低的 RDS(on),降低导通损耗。22nC 的栅极电荷量和较小的 Crss 有利于在开关频率较高的场合减少开关损耗与驱动能耗。器件通过 100% 雪崩耐量测试,可靠性经过完整功能认证,并符合 RoHS/绿色产品要求。

四、典型应用

  • 同步降压转换器(点对点电源、笔记本/通信电源模块)
  • DC-DC 转换、负载开关和功率管理模块
  • 电机驱动与功率开关场合(中等电流)
  • 汽车电子辅助电源(在符合温度和认证要求下)

五、选型与使用建议

  1. 驱动电压:为获得标称 RDS(on),建议驱动栅极至 10V。若采用逻辑电平驱动,请确认在较低 Vgs 下的 RDS(on) 与散热预算。
  2. 开关损耗评估:Qg=22nC 在高频应用会带来显著驱动能耗,驱动器需能提供相应峰值电流;同时较小的 Crss 有助于降低开关过渡损耗与电压摆幅。
  3. 散热管理:Pd=41.7W 为理想散热条件下的耗散能力,实际使用中需结合 PCB 铜箔面积、散热片或热沉计算结温上升,避免长期在高结温下工作。
  4. Avalanche 与可靠性:器件支持雪崩耐量,适合有反向能量或不确定过压事件的系统,但仍建议在电路层面加入合适的保护(阻尼、TVS、RC 吸收等)。

六、封装与布局要点

TO252-3L 封装利于中功率 PCB 安装与导热,建议大面积散热焊盘并通过多层铜展开热流。布局时应尽量缩短高电流回路的走线,减小寄生电感,并将栅极驱动与信号地良好隔离,确保开关性能与 EMI 表现。

总结:XR20N06 在 60V/20A 级别中提供了平衡的导通损耗与开关性能,适合同步降压与中等功率开关应用。选型时注意驱动能力与热设计,以发挥器件最佳性能。

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