Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XNRUSEMI XR1212M
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XNRUSEMI XR1212M
- Type
- XNRUSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XNRUSEMI
- Electronic Component
- XR1212M
- Electronic Component
- 1
- Package
- DFN2020-6L
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.038g
- Electronic Component
- 1
- Electronic Component
- BM0264974452
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 1.9W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XR1212M 产品概述
一、产品简介
XR1212M 是 XNRUSEMI（新锐）推出的一款高单元密度沟槽式 P 沟道 MOSFET，专为大多数同步降压转换器的高侧应用和功率管理场景优化设计。器件在低压（Vdss = 20V）下提供优异的导通电阻与栅极充放电特性，适用于空间受限的移动与通信电源模块。
二、主要电气参数
- 类型：P沟道沟槽式MOSFET
- 漏源电压 Vdss：20 V
- 连续漏极电流 Id：12 A
- 导通电阻 RDS(on)：16 mΩ @ Vgs = 4.5 V
- 耗散功率 Pd：1.9 W
- 阈值电压 Vgs(th)：1 V
- 总栅极电荷 Qg：19 nC @ 4.5 V
- 输入电容 Ciss：1.3 nF；反向传输电容 Crss：279 pF
- 工作温度：-55 ℃ ~ +150 ℃
三、封装与热管理
封装为 DFN2020-6L，小体积利于高密度 PCB 布局。由于封装面积有限，建议在 PCB 设计中使用足够的散热铜箔和过孔（thermal vias）将热量传导到内部/背面散热层，以降低结温并提升长期可靠性。器件额定耗散功率 Pd = 1.9 W，应在实际工作点评估实际结温。
四、典型应用与使用建议
- 同步降压转换器（高侧开关）
- 负载开关、反向保护与电源路径控制
使用时需注意 P 沟道器件为负向栅源驱动（相对于源极），确保栅极驱动幅值与驱动速率匹配 Qg（19 nC）以控制开关损耗。推荐在门极串联小阻值以抑制振铃，并在高频开关应用中做好栅极驱动回路的阻抗控制与去耦。
五、PCB 布局与可靠性要点
布局要点：缩短源/漏与驱动回路的回流路径，增大散热铜箔面积，靠近器件放置退耦电容。产品符合 RoHS 和绿色环保要求，并提供 100% EAS 保证和全功能可靠性测试，适合工业级与消费级长期供应链需求。
六、总结
XR1212M 在 20V 级别提供低 RDS(on) 与中等栅极电荷的均衡设计，适合对导通损耗与开关损耗都有要求的同步降压与电源路径控制场景。合理的 PCB 热设计与匹配的栅极驱动能发挥器件最佳性能。若需针对具体工作点的损耗计算或布局建议，可提供额外参数协助评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
