WMSIC Electronic Components

YLPTEC AM1DS-0505SJZ AM1DS

ModelAM1DS-0505SJZ
PackageSIP,19.5x6mm
BrandYLPTEC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
YLPTEC AM1DS-0505SJZ
Type
YLPTEC
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
YLPTEC
Electronic Component
AM1DS-0505SJZ
Electronic Component
1
Electronic Component
6mm
Package
SIP,19.5x6mm
Electronic Component
Isolated Power Supply Module
Electronic Component
2.27g
Electronic Component
19.5mm
Electronic Component
10mm
Electronic Component
1
Electronic Component
BM0265023114
Operating Temperature
40℃~+85℃
Switching Frequency
100kHz
Electronic Component
30mVp-p
Conversion
88%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AM1DS-0505SJZ 产品概述

一、产品简介

AM1DS-0505SJZ 是 YLPTEC(易川)推出的一款高可靠性、单通道隔离型直流变换模块。模块输入为 4.5V~5.5V,输出固定 5V,最大输出功率 1W,适用于需要低功耗、小体积、高绝缘强度的隔离供电场合。19.5×6×10mm 的 SIP 封装便于在工业控制、信号隔离和嵌入式系统中直接插装或点对点焊接。

二、主要参数

  • 输出通道数:1
  • 输入电压 Vin:4.5V ~ 5.5V
  • 输出电压 Vout:5V(± 标称)
  • 输出功率:1W(最大)
  • 最大输出电流:200mA
  • 转换效率:典型 88%(满载条件)
  • 最大容性负载:2400µF
  • 隔离电压 Vrms:1500V
  • 开关频率:100kHz
  • 静态电流(空载):5mA
  • 输出纹波噪声:≤30mVp-p
  • 工作温度:-40℃~+85℃
  • 外形尺寸(封装):SIP 19.5×6×10 mm

三、关键特性

  1. 可靠的隔离性能:模块具备 1.5kVrms 的绝缘能力,可有效消除地环路干扰,适合信号接口与数字电路之间的电气隔离。
  2. 高效率、低发热:满载效率约 88%,在 1W 输出时器件损耗约 0.136W,整体热负荷小,有利于在限温环境中长期可靠工作。
  3. 宽温区可靠运行:支持 -40℃ 至 +85℃ 的工作温度范围,满足工业级环境要求。
  4. 完善的保护机制:内置短路保护并支持自动故障恢复,具备过热保护功能,异常时自动进入保护并在条件恢复后自动恢复输出,减少外部保护电路需求。
  5. 低纹波与大容性兼容:输出纹波 ≤30mVp-p,能驱动高达 2400µF 的容性负载,适用于对低噪声有要求的模拟或数字电路。

四、典型应用

  • 工业控制系统的隔离供电与信号耦合(例如隔离型传感器供电、隔离 ADC/采集前端)
  • 通讯接口隔离(RS‑485、CAN、UART 等)
  • 仪器仪表及测试设备中需要低噪声、隔离的小功率电源模块
  • 嵌入式系统中消除接地回路、保护敏感模块免受共模干扰
  • 电源冗余或局部小功率隔离供电场景

五、设计与使用建议

  • 输入侧建议并联 4.7µF~10µF 的陶瓷去耦电容,靠近模块引脚安装,以抑制输入瞬态。
  • 输出侧为了保证瞬态响应与稳定性,推荐在模块输出并联低 ESR 电容,范围可根据实际负载调整,模块支持最大容性负载至 2400µF。
  • 布局时保持输入、输出回路短且宽,尽量将地线分离并采用单点接地方式以减少噪声耦合。
  • 虽然模块自带过热保护,但在高环境温度或密闭空间内建议进行散热评估,必要时保证一定的通风或增加散热措施。
  • 避免长期运行在超出额定输入电压范围或短时高压冲击下,以延长使用寿命并维持隔离性能。

六、封装与机械信息

  • 品牌:YLPTEC(易川)
  • 封装形式:SIP(19.5×6×10 mm),利于插装或直插焊接
  • 安装注意事项:针脚焊接时控制回流温度和时间,避免在封装上产生机械应力;插装板上预留合适孔距便于后续更换与维修。

总结:AM1DS-0505SJZ 面向需要小型化、可靠隔离和低噪声电源的应用场景,兼具高效率与多重保护功能,是替代光耦隔离供电或为隔离信号前端供电的稳妥选择。若需评估在特定工况下的温升、输出纹波随负载变化曲线或进一步的电气引脚图,请提供具体使用条件或索取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.